Inventor
HO PAUL S
US14 patents
⚠️ This page may combine multiple inventors who share the name “HO PAUL S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS4886681ADec 12, 1989
Metal-polymer adhesion by low energy bombardment
IBM62 citations94
US4319264AMar 9, 1982
Nickel-gold-nickel conductors for solid state devices
IBM31 citations92
US4154874AMay 15, 1979
Method for forming intermetallic layers in thin films for improved electromigration resistance
IBM32 citations92
US4268584AMay 19, 1981
Nickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbon
IBM23 citations81
US4166279AAug 28, 1979
Electromigration resistance in gold thin film conductors
IBM28 citations81
US4316209AFeb 16, 1982
Metal/silicon contact and methods of fabrication thereof
IBM19 citations78
US4622205ANov 11, 1986
Electromigration lifetime increase of lead base alloys
IBM14 citations67
UNIV TEXAS
5 patentsUS6919639B2Jul 19, 2005
Multiple copper vias for integrated circuit metallization and methods of fabricating same
UNIV TEXAS18 citations90
US10170399B2Jan 1, 2019
Capped through-silicon-vias for 3D integrated circuits
UNIV TEXAS6 citations81
US7078817B2Jul 18, 2006
Multiple copper vias for integrated circuit metallization
UNIV TEXAS7 citations71
US11103460B2Aug 31, 2021
Fabrication methods for nanodelivery systems for long term controlled delivery of active pharmaceutical ingredients
UNIV TEXAS0 citations56
US10727165B2Jul 28, 2020
Capped through-silicon-vias for 3D integrated circuits
UNIV TEXAS0 citations49