Inventor

BRUNSCHWILER THOMAS J

CH51 patents

⚠️ This page may combine multiple inventors who share the name “BRUNSCHWILER THOMAS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRUNSCHWILER THOMAS J

IBM

Integrated circuit stack

Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate

Semiconductor device with a high thermal dissipation efficiency

Variable flow computer cooling system for a data center and method of operation

Semiconductor device with a high thermal dissipation efficiency

Adaptive optical interconnection of components of an electro-optical circuit

Variable flow computer cooling system for a data center and method of operation

Variable performance server system and method of operation

Patterned structure for a thermal interface

Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies

Semiconductor device with a high thermal dissipation efficiency

Semiconductor chip assembly with flexible metal cantilevers

Counter-flow expanding channels for enhanced two-phase heat removal

Chip stack structures that implement two-phase cooling with radial flow

Chip stack structures that implement two-phase cooling with radial flow

Thermal interface with a patterned structure

Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section

Releasable, threadless conduit connector for liquid manifold

Counter-flow expanding channels for enhanced two-phase heat removal

Chip package for two-phase cooling and assembly process thereof

Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section

Disassemblable electronic assembly with leak-inhibiting coolant capillaries

Method for electrical coupling and electric coupling arrangement

Releasable, threadless conduit connector for liquid manifold

Adsorption heat exchanger devices

Chip stack structures that implement two-phase cooling with radial flow

Releasable, threadless conduit connector for liquid manifold

Counter-flow expanding channels for enhanced two-phase heat removal

Counter-flow expanding channels for enhanced two-phase heat removal

Adsorption heat exchanger devices

Integrated helical multi-layer inductor structures

Bridging arrangement and method for manufacturing a bridging arrangement

Manufacturing an underfill in a semiconductor chip package

Circuitized substrate with electronic components mounted on transversal portion thereof

Circuitized substrate with electronic components mounted on transversal portion thereof

Circuitized substrate with electronic components mounted on transversal portion thereof

Method for electrical coupling and electric coupling arrangement

Method for manufacturing a filled cavity between a first and a second surface

Dense assembly of laterally soldered, overmolded chip packages

BRUNSCHWILER THOMAS J

Variable flow computer cooling system for a data center and method of operation

Electronic assembly with detachable coolant manifold and coolant-cooled electronic module

Cooling device

Integrated circuit stack

Adsorption heat exchanger devices

Bridging arrangement and method for manufacturing a bridging arrangement

One-dimensional hierarchical nested channel design for continuous feed manufacturing processes

GLOBALFOUNDRIES INC

Method and device for cooling a heat generating component

Silver alloying post-chip join

Method and device for cooling a heat generating component

MICHEL BRUNO

Patterned structure for a thermal interface