Inventor

NIU ZHIQIANG

US39 patents

⚠️ This page may combine multiple inventors who share the name “NIU ZHIQIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NIU ZHIQIANG

ALPHA & OMEGA SEMICONDUCTOR

Semiconductor power device having single in-line lead module and method of making the same

Embedded package and method thereof

MCSP power semiconductor devices and preparation methods thereof

Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures

Embedded package and method thereof

Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures

Battery protection package and process of making the same

Battery protection package and process of making the same

Substrateless power device packages

Power device and preparation method thereof

Wafer process for molded chip scale package (MCSP) with thick backside metallization

Wafer process for molded chip scale package (MCSP) with thick backside metallization

ALPHA & OMEGA SEMICONDUCTOR INT LP

Method of making reverse conducting insulated gate bipolar transistor

Power semiconductor module

Intelligent power module containing IGBT and super-junction MOSFET

Chip scale semiconductor package having back side metal layer and raised front side pad and method of making the same

Power semiconductor module

Power semiconductor module

Power converter for high power density applications

Power converter for high power density

DMOS FET chip scale package and method of making the same

Semiconductor package having enlarged gate pad and method of making the same

Semiconductor power module package having lead frame anchored bars

Intelligent power module containing exposed surfaces of transistor die supporting elements

ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD

Molded intelligent power module and method of making the same

Molded intelligent power module for motors

HV converter with reduced EMI

Molded intelligent power module

Semiconductor package and method of making the same

Semiconductor power device having single in-line lead module and method of making the same

Molded intelligent power module and method of making the same

Molded power module having single in-line leads

HV converter with reduced EMI

ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD

Molded intelligent power module

Molded intelligent power module

YILMAZ HAMZA

Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures

FENG TAO

Substrateless power device packages

TENCENT TECH SHENZHEN CO LTD

Distributed flow control

NIU ZHIQIANG

Aluminum alloy lead-frame and its use in fabrication of power semiconductor package