Inventor
HASHIMOTO KIYOAKI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “HASHIMOTO KIYOAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INC
8 patentsUS9224717B2Dec 29, 2015
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC76 citations97
US9093435B2Jul 28, 2015
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC68 citations97
US10062661B2Aug 28, 2018
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC5 citations84
US10593643B2Mar 17, 2020
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC1 citations73
US9691731B2Jun 27, 2017
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC1 citations62
US10833044B2Nov 10, 2020
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC0 citations52
US9716075B2Jul 25, 2017
Semiconductor chip assembly and method for making same
TESSERA INC0 citations52
US9337165B2May 10, 2016
Method for manufacturing a fan-out WLP with package
TESSERA INC0 citations51
SATO HIROAKI
3 patentsUS8618659B2Dec 31, 2013
Package-on-package assembly with wire bonds to encapsulation surface
SATO HIROAKI147 citations98
US8890304B2Nov 18, 2014
Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material
SATO HIROAKI3 citations62
US8525338B2Sep 3, 2013
Chip with sintered connections to package
SATO HIROAKI1 citations51