Inventor
LU MING-CHEN
CN27 patents
⚠️ This page may combine multiple inventors who share the name “LU MING-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ALPHA & OMEGA SEMICONDUCTOR
11 patentsUS9269699B2Feb 23, 2016
Embedded package and method thereof
ALPHA & OMEGA SEMICONDUCTOR6 citations84
US9653383B2May 16, 2017
Semiconductor device with thick bottom metal and preparation method thereof
ALPHA & OMEGA SEMICONDUCTOR15 citations83
US9230949B2Jan 5, 2016
Method of making stacked multi-chip packaging structure
ALPHA & OMEGA SEMICONDUCTOR4 citations73
US9472491B2Oct 18, 2016
Semiconductor package with small gate clip and assembly method
ALPHA & OMEGA SEMICONDUCTOR1 citations63
US9171788B1Oct 27, 2015
Semiconductor package with small gate clip and assembly method
ALPHA & OMEGA SEMICONDUCTOR3 citations63
US9437587B2Sep 6, 2016
Flip chip semiconductor device
ALPHA & OMEGA SEMICONDUCTOR2 citations62
US10043736B2Aug 7, 2018
Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
ALPHA & OMEGA SEMICONDUCTOR0 citations52
US9685430B2Jun 20, 2017
Embedded package and method thereof
ALPHA & OMEGA SEMICONDUCTOR0 citations52
US9679833B2Jun 13, 2017
Semiconductor package with small gate clip and assembly method
ALPHA & OMEGA SEMICONDUCTOR0 citations52
US9425181B2Aug 23, 2016
Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures
ALPHA & OMEGA SEMICONDUCTOR0 citations52
US9337131B2May 10, 2016
Power semiconductor device and the preparation method
ALPHA & OMEGA SEMICONDUCTOR0 citations40
ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD
4 patentsUS9245831B1Jan 26, 2016
Top-exposed semiconductor package and the manufacturing method
ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD3 citations72
US11062969B2Jul 13, 2021
Wafer level chip scale package structure and manufacturing method thereof
ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD0 citations58
US10504823B2Dec 10, 2019
Power semiconductor device with small contact footprint and the preparation method
ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD0 citations51
US10242926B2Mar 26, 2019
Wafer level chip scale package structure and manufacturing method thereof
ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD0 citations47
YILMAZ HAMZA
3 patentsUS9054091B2Jun 9, 2015
Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
YILMAZ HAMZA6 citations84
US8952509B1Feb 10, 2015
Stacked multi-chip bottom source semiconductor device and preparation method thereof
YILMAZ HAMZA15 citations82
US9087828B2Jul 21, 2015
Semiconductor device with thick bottom metal and preparation method thereof
YILMAZ HAMZA2 citations61