Inventor
LAI CHIEN-CHIH
TW22 patents
⚠️ This page may combine multiple inventors who share the name “LAI CHIEN-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UBRIGHT OPTRONICS CORP
7 patentsUS10288265B1May 14, 2019
Optical assembly and the method to make the same
UBRIGHT OPTRONICS CORP2 citations71
US9725269B2Aug 8, 2017
Sheet winding structure
UBRIGHT OPTRONICS CORP2 citations70
US12013554B2Jun 18, 2024
Quantum-dot composite film and the method to make the same
UBRIGHT OPTRONICS CORP0 citations59
US11885987B2Jan 30, 2024
Quantum-dot film and the method to make the same
UBRIGHT OPTRONICS CORP0 citations57
US12061315B2Aug 13, 2024
Composite barrier film for attaching to a quantum-dot film and the method to make the same
UBRIGHT OPTRONICS CORP0 citations56
US10429552B2Oct 1, 2019
Optical sheet having a composite structure thereon and method to make the same
UBRIGHT OPTRONICS CORP0 citations50
US10175393B2Jan 8, 2019
Optical sheet having a composite structure thereon and method to make the same
UBRIGHT OPTRONICS CORP0 citations50
COMCHIP TECH CO LTD
7 patentsUS10910268B2Feb 2, 2021
Method of manufacturing a chip package
COMCHIP TECH CO LTD0 citations60
US11302664B2Apr 12, 2022
Method of manufacturing die package structure
COMCHIP TECH CO LTD0 citations50
US11264355B2Mar 1, 2022
Method of manufacturing die package structure
COMCHIP TECH CO LTD0 citations50
US10950502B2Mar 16, 2021
Method of manufacturing a chip package
COMCHIP TECH CO LTD0 citations50
US10937760B2Mar 2, 2021
Method for manufacturing a chip package
COMCHIP TECH CO LTD0 citations50
US10777461B2Sep 15, 2020
Method for manufacturing a chip package
COMCHIP TECH CO LTD0 citations50
US10665509B2May 26, 2020
Method for manufacturing chip packages
COMCHIP TECH CO LTD0 citations39