Inventor

KANG UN-BYOUNG

KR81 patents

⚠️ This page may combine multiple inventors who share the name “KANG UN-BYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANG UN-BYOUNG

SAMSUNG ELECTRONICS CO LTD

Semiconductor package and method of fabricating the same

Camera module and electronic apparatus having the same

Semiconductor package having recessed adhesive layer between stacked chips

Semiconductor package

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Semiconductor package with ferrite shielding structure

Methods for processing substrates

Method for manufacturing semiconductor package having redistribution layer

Semiconductor devices and semiconductor packages including the same

Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads

Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same

Method of fabricating an interposer

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Semiconductor package

Stacked image sensor package and stacked image sensor module including the same

Pre-package and methods of manufacturing semiconductor package and electronic device using the same

Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips

Semiconductor package including a pad contacting a via

Semiconductor package and method of fabricating the same

Semiconductor packages including stacked substrates and penetration electrodes

Method of fabricating semiconductor package

Semiconductor package having redistribution layer

Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package

Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same

Semiconductor package

Semiconductor package with dummy pattern not electrically connected to circuit pattern

Semiconductor package with dummy pattern not electrically connected to circuit pattern

Multi-chip package and method of manufacturing the same

Semiconductor device including lower pads having different widths and semiconductor package including the same

Semiconductor package

Semiconductor devices and semiconductor packages including the same

Stacked semiconductor package

Semiconductor devices and semiconductor packages including the same

Stacked semiconductor package

Semiconductor package having redistribution layer

KANG UN-BYOUNG

Semiconductor device and method of forming the same

Chip-stacked semiconductor package and method of manufacturing the same

Multi-chip package and method of manufacturing the same

LEE HO-JIN

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

LEE GO EUN

Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip

LEE HO JIN

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

KANG UN BYOUNG

Method of fabricating a semiconductor device

IM YUN-HYEOK

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

HAN SANG UK

Semiconductor package and method of fabricating the same

KIM JUNG-HWAN

Semiconductor package and method of manufacturing the same

CHANG GUN-HO

Pre-package and methods of manufacturing semiconductor package and electronic device using the same

HONG JISUN

Method for wafer level package and semiconductor device fabricated using the same