Inventor

PAIK KYUNG-WOOK

KR17 patents

⚠️ This page may combine multiple inventors who share the name “PAIK KYUNG-WOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAIK KYUNG-WOOK

KOREA ADVANCED INST SCI & TECH

Method for fabricating chip size packages using lamination process

Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate

High adhesion triple layered anisotropic conductive adhesive film

Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method

CMOS image sensor module with wafers

Method for manufacturing conductive adhesive for high frequency flip chip package applications

Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same

Method of uniformly dispersing nickel-plated conductive particles of single layer within polymer film by applying magnetic field to polymer film and method of fabricating anisotropic conductive film using the same

GEN ELECTRIC

Method of forming thin film resistors on organic surfaces

Thin film resistors on organic surfaces

HYUNDAI ELECTRONICS IND

Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer

Method of making stackable semiconductor chips to build a stacked chip module

MARTIN MARIETTA CORP

Fabrication of compact magnetic circulator components in microwave packages using high density interconnections

Fabrication of compact magnetic circulator components in microwave packages using high density interconnections

TELEPHUS INC

High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same

SAMSUNG ELECTRONICS CO LTD

Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package

KIM DEOK HOON

Fiber, fiber aggregate and adhesive having the same