Inventor

JEE YOUNG-KUN

KR22 patents

⚠️ This page may combine multiple inventors who share the name “JEE YOUNG-KUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JEE YOUNG-KUN

SAMSUNG ELECTRONICS CO LTD

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Semiconductor package and method for fabricating the same

Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads

Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips

Semiconductor packages including stacked substrates and penetration electrodes

Semiconductor package having redistribution layer

Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same

Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package

Semiconductor package

Semiconductor package having redistribution layer

Semiconductor package

Semiconductor packages having TSV and adhesive layer

Semiconductor packages

Semiconductor chip, semiconductor package including the same, and method of fabricating the same

Semiconductor packages and methods of manufacturing the same

Substrate of semiconductor package and method of fabricating semiconductor package using the same

Substrate of semiconductor package and method of fabricating semiconductor package using the same

JEE YOUNG-KUN

Chip-stacked semiconductor package

Semiconductor package having an anti-contact layer

CHOE YEONG HWAN

Semiconductor device having stacked semiconductor chips interconnected via TSV