Inventor
LEE DAIN
KR9 patents
⚠️ This page may combine multiple inventors who share the name “LEE DAIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
6 patentsUS11729966B2Aug 15, 2023
DRAM device including an air gap and a sealing layer
SAMSUNG ELECTRONICS CO LTD2 citations70
US11335689B2May 17, 2022
DRAM device including an air gap and a sealing layer
SAMSUNG ELECTRONICS CO LTD3 citations70
US11177215B2Nov 16, 2021
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD1 citations60
US12230498B2Feb 18, 2025
Method for manufacturing semiconductor device including air gap
SAMSUNG ELECTRONICS CO LTD0 citations56
US12426245B2Sep 23, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations55
US11037991B2Jun 15, 2021
Variable resistance memory device
SAMSUNG ELECTRONICS CO LTD0 citations46
HANKUK CARBON CO LTD
3 patentsUS9932118B2Apr 3, 2018
Vertical take-off and landing aircraft using hybrid electric propulsion system
HANKUK CARBON CO LTD19 citations89
US10099794B2Oct 16, 2018
Vertical take-off and landing aircraft using hybrid-electric propulsion system
HANKUK CARBON CO LTD6 citations79
US10035604B2Jul 31, 2018
Vertical take-off and landing aircraft using hybrid-electric propulsion system
HANKUK CARBON CO LTD8 citations79