Inventor
Hong Yejie
CN15 patents
Patents
15 patentsUS12040272B2Jul 16, 2024
Connector for implementing multi-faceted interconnection
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11769733B2Sep 26, 2023
Package substrate
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11682621B2Jun 20, 2023
Connector for implementing multi-faceted interconnection
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11515258B2Nov 29, 2022
Package substrate and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11503712B2Nov 15, 2022
Passive device packaging structure embedded in glass medium and method for manufacturing the same
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US12040526B2Jul 16, 2024
Method for manufacturing embedded package structure having air resonant cavity
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US12532769B2Jan 20, 2026
Package substrate based on molding process and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations51
US12300576B2May 13, 2025
Cyclic cooling embedded packaging substrate and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations51
US12278227B2Apr 15, 2025
Hybrid embedded packaging structure and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations51
US12230581B2Feb 18, 2025
Multi-device graded embedding package substrate and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations51
US11961743B2Apr 16, 2024
Substrate manufacturing method for realizing three-dimensional packaging
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations51
US12599019B2Apr 7, 2026
Embedded packaging structure and manufacturing method thereof
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations50
US11903133B2Feb 13, 2024
Structure for embedding and packaging multiple devices by layer and method for manufacturing same
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations50
US11342273B2May 24, 2022
Package structure of integrated passive device and manufacturing method thereof, and substrate
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations50
US12402414B2Aug 26, 2025
Capacitor and inductor embedded structure and manufacturing method therefor, and substrate
ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations49