Inventor

Huang Benxia

CN41 patents

⚠️ This page may combine multiple inventors who share the name “Huang Benxia”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Huang Benxia

ZHUHAI ACCESS SEMICONDUCTOR CO LTD

Temporary carrier and method for manufacturing coreless substrate thereby

Embedded packaging method capable of realizing heat dissipation

Connector for implementing multi-faceted interconnection

Packaging structure with antenna and manufacturing method thereof

Package substrate

Connector for implementing multi-faceted interconnection

Package substrate and manufacturing method thereof

Passive device packaging structure embedded in glass medium and method for manufacturing the same

Embedded chip package and manufacturing method thereof

Method for manufacturing embedded package structure having air resonant cavity

Embedded chip package and manufacturing method thereof

Interposer board without feature layer structure and method for manufacturing the same

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

Embedded packaging structure having shielding cavity and manufacturing method thereof

Method for manufacturing coreless substrate

Support frame structure and manufacturing method thereof

Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof

Support frame structure and manufacturing method thereof

Package substrate based on molding process and manufacturing method thereof

Inductor-integrating embedded support frame and substrate, and manufacturing method thereof

Cyclic cooling embedded packaging substrate and manufacturing method thereof

Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same

Hybrid embedded packaging structure and manufacturing method thereof

Multi-device graded embedding package substrate and manufacturing method thereof

Substrate manufacturing method for realizing three-dimensional packaging

Embedded packaging structure and manufacturing method thereof

Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate

Embedded structure, manufacturing method thereof and substrate

Structure for embedding and packaging multiple devices by layer and method for manufacturing same

Package structure of integrated passive device and manufacturing method thereof, and substrate

Embedded packaging structure and method for manufacturing the same

Capacitor and inductor embedded structure and manufacturing method therefor, and substrate

Liquid circulating cooling package substrate and manufacturing method thereof

Package substrate manufacturing method

Substrate embedded with integrated inductor and manufacturing method thereof

Carrier plate for preparing package substrate, package substrate structure and manufacturing method thereof

Embedded flip chip package substrate and manufacturing method thereof

UNIV ELECTRONIC SCI & TECH CHINA

Fabrication method for package structure

ZHUHAI YUEXIN SEMICONDUCTOR LLC

Embedded inductance structure and manufacturing method thereof

NANTONG ACCESS SEMICONDUCTOR CO LTD

Embedded packaging structure and manufacturing method thereof