Inventor
OOHIRAKI TOMOYA
JP16 patents
Patents
16 patentsUS10211068B2Feb 19, 2019
Power-module substrate with cooler and method of producing the same
MITSUBISHI MATERIALS CORP4 citations72
US11476127B2Oct 18, 2022
Manufacturing method of electronic-component-mounted module
MITSUBISHI MATERIALS CORP3 citations71
US10032648B2Jul 24, 2018
Method of manufacturing power-module substrate with heat-sink
MITSUBISHI MATERIALS CORP4 citations71
US10607915B2Mar 31, 2020
Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device
MITSUBISHI MATERIALS CORP3 citations70
US11908768B2Feb 20, 2024
Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board
MITSUBISHI MATERIALS CORP0 citations61
US11289390B2Mar 29, 2022
Insulation circuit board with heat sink
MITSUBISHI MATERIALS CORP0 citations61
US11289400B2Mar 29, 2022
Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board
MITSUBISHI MATERIALS CORP0 citations61
US10453772B2Oct 22, 2019
Heat-sink-attached power-module substrate and power module
MITSUBISHI MATERIALS CORP1 citations61
US11676882B2Jun 13, 2023
Method of manufacturing power module substrate board and ceramic-copper bonded body
MITSUBISHI MATERIALS CORP0 citations52
US11355415B2Jun 7, 2022
Heat sink-attached power module substrate board and power module
MITSUBISHI MATERIALS CORP0 citations50
US11322424B2May 3, 2022
Insulation circuit board with heat sink
MITSUBISHI MATERIALS CORP0 citations50
US11315868B2Apr 26, 2022
Electronic-component-mounted module design to reduce linear expansion coefficient mismatches
MITSUBISHI MATERIALS CORP0 citations50
US10068829B2Sep 4, 2018
Power-module substrate unit and power module
MITSUBISHI MATERIALS CORP1 citations50
US9837363B2Dec 5, 2017
Power-module substrate unit and power module
MITSUBISHI MATERIALS CORP1 citations50
US9579739B2Feb 28, 2017
Manufacturing method of power-module substrate
MITSUBISHI MATERIALS CORP1 citations50
US11735434B2Aug 22, 2023
Method for producing insulating circuit substrate with heat sink
MITSUBISHI MATERIALS CORP0 citations48