Inventor
CHEN CHIH-LIN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIH-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS10763164B2Sep 1, 2020
Package structure with inductor and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10535635B2Jan 14, 2020
Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11658157B2May 23, 2023
Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11043473B2Jun 22, 2021
Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12062641B2Aug 13, 2024
Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11562926B2Jan 24, 2023
Package structure and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11075136B2Jul 27, 2021
Heat transfer structures and methods for IC packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12411508B2Sep 9, 2025
Semiconductor devices including voltage monitors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10559517B2Feb 11, 2020
Heat transfer structures and methods for IC packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163751B2Dec 25, 2018
Heat transfer structures and methods for IC packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52