Inventor

BERRY CHRISTOPHER J

US76 patents

⚠️ This page may combine multiple inventors who share the name “BERRY CHRISTOPHER J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BERRY CHRISTOPHER J

IBM

Method for replicating and synchronizing a plurality of physical instances with a logical master

Double data rate chaining for synchronous DDR interfaces

Selective deposition process for physical vapor deposition

Intra-run design decision process for circuit synthesis

Constraint-driven pin optimization for hierarchical design convergence

Critical region identification

Slack redistribution for additional power recovery

Hierarchically aware interior pinning for large synthesis blocks

Simulation of modifications to microprocessor design

Hierarchically aware interior pinning for large synthesis blocks

Scoping searches within websites

Physical aware technology mapping in synthesis

Late data launch for a double data rate elastic interface

Critical region identification

Method for simplifying tie net modeling for router performance

Decoupling capacitance analysis method

Decoupling capacitance analysis method

Decoupling capacitance analysis method

Method for optimizing scan chains in an integrated circuit that has multiple levels of hierarchy

Semi-flattened pin optimization process for hierarchical physical designs

Facilitating the design of a clock grid in an integrated circuit

Buffer placement with respect to data flow direction and placement area geometry in hierarchical VLS designs

Data processing system to implement wiring/silicon blockages via parameterized cells

AMKOR TECHNOLOGY INC

Thin stacked interposer package

Semiconductor device having RF shielding and method therefor

Semiconductor device having EMI shielding and method therefor

Semiconductor device having RF shielding and method therefor

Dual laminate package structure with embedded elements

Thin bonded interposer package

Dual laminate package structure with embedded elements

Stackable semiconductor package including laminate interposer

Membrane die attach circuit element package and method therefor

Etch singulated semiconductor package

Bend test method and apparatus for flip chip devices

Exposed metal bezel for use in sensor devices and method therefor

Etch singulated semiconductor package

Thin bonded interposer package

Semiconductor package in package

Copper pillar sidewall protection

BERRY CHRISTOPHER J

Thin stacked interposer package

Dual laminate package structure with embedded elements

Semiconductor device having RF shielding and method therefor

SAVANNAH RIVER NUCLEAR SOLUTIO

Biological enhancement of hydrocarbon extraction

Surfactant biocatalyst for remediation of recalcitrant organics and heavy metals

SAVANNAH RIVER NUCLEAR SOLUTIONS LLC

Surfactant biocatalyst for remediation of recalcitrant organics and heavy metals

Surfactant biocatalyst for remediation of recalcitrant organics and heavy metals

SCANLAN CHRISTOPHER M

Semiconductor package in package

REDEEM INC

Anticholesterolemic edible oil

AMKOR TECH SINGAPORE HOLDING PTE LTD

Thin bonded interposer package

MALGIOGLIO FRANK

Computer program product, apparatus, and method for inserting components in a hierarchical chip design