Inventor
LEDERMANN PETER G
US12 patents
Patents
12 patentsUS5117457AMay 26, 1992
Tamper resistant packaging for information protection in electronic circuitry
IBM370 citations97
US5343366AAug 30, 1994
Packages for stacked integrated circuit chip cubes
IBM141 citations96
US5189363AFeb 23, 1993
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester
IBM66 citations96
US4934309AJun 19, 1990
Solder deposition system
IBM67 citations95
US4814855AMar 21, 1989
Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
IBM64 citations95
US5028983AJul 2, 1991
Multilevel integrated circuit packaging structures
IBM78 citations93
US4898117AFeb 6, 1990
Solder deposition system
IBM36 citations92
US4970579ANov 13, 1990
Integrated circuit package with improved cooling means
IBM46 citations90
US5065932ANov 19, 1991
Solder placement nozzle with inert cover gas and inert gas bleed
IBM26 citations85
US5042708AAug 27, 1991
Solder placement nozzle assembly
IBM25 citations84
US4881885ANov 21, 1989
Dam for lead encapsulation
IBM19 citations81
US5130781AJul 14, 1992
Dam for lead encapsulation
IBM15 citations73