Inventor
ROCHA-ALVAREZ JUAN CARLOS
US158 patents
⚠️ This page may combine multiple inventors who share the name “ROCHA-ALVAREZ JUAN CARLOS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
44 patentsUS10950477B2Mar 16, 2021
Ceramic heater and esc with enhanced wafer edge performance
APPLIED MATERIALS INC280 citations99
US7566891B2Jul 28, 2009
Apparatus and method for treating a substrate with UV radiation using primary and secondary reflectors
APPLIED MATERIALS INC553 citations98
US7500445B2Mar 10, 2009
Method and apparatus for cleaning a CVD chamber
APPLIED MATERIALS INC187 citations98
US6946033B2Sep 20, 2005
Heated gas distribution plate for a processing chamber
APPLIED MATERIALS INC227 citations98
US6797643B2Sep 28, 2004
Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power
APPLIED MATERIALS INC84 citations98
US9466469B2Oct 11, 2016
Remote plasma source for controlling plasma skew
APPLIED MATERIALS INC121 citations97
US9157730B2Oct 13, 2015
PECVD process
APPLIED MATERIALS INC49 citations97
US6591850B2Jul 15, 2003
Method and apparatus for fluid flow control
APPLIED MATERIALS INC68 citations96
US7589336B2Sep 15, 2009
Apparatus and method for exposing a substrate to UV radiation while monitoring deterioration of the UV source and reflectors
APPLIED MATERIALS INC39 citations95
US10774423B2Sep 15, 2020
Tunable ground planes in plasma chambers
APPLIED MATERIALS INC41 citations94
US7166544B2Jan 23, 2007
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors
APPLIED MATERIALS INC20 citations93
US9816187B2Nov 14, 2017
PECVD process
APPLIED MATERIALS INC8 citations92
US9458537B2Oct 4, 2016
PECVD process
APPLIED MATERIALS INC12 citations92
US7909595B2Mar 22, 2011
Apparatus and method for exposing a substrate to UV radiation using a reflector having both elliptical and parabolic reflective sections
APPLIED MATERIALS INC18 citations92
US7829145B2Nov 9, 2010
Methods of uniformity control for low flow process and chamber to chamber matching
APPLIED MATERIALS INC18 citations92
US7777198B2Aug 17, 2010
Apparatus and method for exposing a substrate to a rotating irradiance pattern of UV radiation
APPLIED MATERIALS INC29 citations92
US7663121B2Feb 16, 2010
High efficiency UV curing system
APPLIED MATERIALS INC38 citations92
US7622005B2Nov 24, 2009
Uniformity control for low flow process and chamber to chamber matching
APPLIED MATERIALS INC19 citations92
US7572337B2Aug 11, 2009
Blocker plate bypass to distribute gases in a chemical vapor deposition system
APPLIED MATERIALS INC43 citations92
US6914014B2Jul 5, 2005
Method for curing low dielectric constant film using direct current bias
APPLIED MATERIALS INC32 citations92
US10480074B2Nov 19, 2019
Apparatus for radical-based deposition of dielectric films
APPLIED MATERIALS INC15 citations85
US11492705B2Nov 8, 2022
Isolator apparatus and methods for substrate processing chambers
APPLIED MATERIALS INC8 citations84
US10793954B2Oct 6, 2020
PECVD process
APPLIED MATERIALS INC3 citations84
US10483141B2Nov 19, 2019
Semiconductor process equipment
APPLIED MATERIALS INC13 citations84
US10431480B2Oct 1, 2019
External substrate rotation in a semiconductor processing system
APPLIED MATERIALS INC6 citations84
US10236197B2Mar 19, 2019
Processing system containing an isolation region separating a deposition chamber from a treatment chamber
APPLIED MATERIALS INC11 citations84
US10060032B2Aug 28, 2018
PECVD process
APPLIED MATERIALS INC3 citations84
US9725806B2Aug 8, 2017
Multi-zone pedestal for plasma processing
APPLIED MATERIALS INC7 citations84
US8657961B2Feb 25, 2014
Method for UV based silylation chamber clean
APPLIED MATERIALS INC8 citations84
US7410916B2Aug 12, 2008
Method of improving initiation layer for low-k dielectric film by digital liquid flow meter
APPLIED MATERIALS INC9 citations84
US6709721B2Mar 23, 2004
Purge heater design and process development for the improvement of low k film properties
APPLIED MATERIALS INC14 citations84
US10403535B2Sep 3, 2019
Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system
APPLIED MATERIALS INC11 citations83
US10083818B2Sep 25, 2018
Auto frequency tuned remote plasma source
APPLIED MATERIALS INC8 citations83
US7259111B2Aug 21, 2007
Interface engineering to improve adhesion between low k stacks
APPLIED MATERIALS INC14 citations83
US8753449B2Jun 17, 2014
Enhancement in UV curing efficiency using oxygen-doped purge for ultra low-K dielectric film
APPLIED MATERIALS INC9 citations82
US7189658B2Mar 13, 2007
Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profile
APPLIED MATERIALS INC11 citations82
US10388549B2Aug 20, 2019
On-board metrology (OBM) design and implication in process tool
APPLIED MATERIALS INC8 citations79
US11613812B2Mar 28, 2023
PECVD process
APPLIED MATERIALS INC2 citations73
US11299805B2Apr 12, 2022
Plasma corrision resistive heater for high temperature processing
APPLIED MATERIALS INC3 citations73
US11293099B2Apr 5, 2022
Showerhead assembly with multiple fluid delivery zones
APPLIED MATERIALS INC1 citations73
US10570517B2Feb 25, 2020
Apparatus and method for UV treatment, chemical treatment, and deposition
APPLIED MATERIALS INC2 citations73
US10266943B2Apr 23, 2019
Plasma corrosion resistive heater for high temperature processing
APPLIED MATERIALS INC4 citations73
US10233543B2Mar 19, 2019
Showerhead assembly with multiple fluid delivery zones
APPLIED MATERIALS INC4 citations73
US10192717B2Jan 29, 2019
Conditioning remote plasma source for enhanced performance having repeatable etch and deposition rates
APPLIED MATERIALS INC3 citations73
BALUJA SANJEEV
2 patentsKASZUBA ANDRZEI
1 patentROCHA-ALVAREZ JUAN CARLOS
1 patentYAP LIPYEOW
1 patentREILLY PATRICK
1 patentShowing the top 50 of 158 patents by PatentIndex Score.