Inventor
TAKAHASHI NOBUYA
JP17 patents
⚠️ This page may combine multiple inventors who share the name “TAKAHASHI NOBUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
7 patentsUS9536801B2Jan 3, 2017
Electronic component having encapsulated wiring board and method for manufacturing the same
IBIDEN CO LTD2 citations73
US9711439B2Jul 18, 2017
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD4 citations72
US9035463B2May 19, 2015
Wiring board and method for manufacturing the same
IBIDEN CO LTD4 citations68
US9338886B2May 10, 2016
Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
IBIDEN CO LTD0 citations50
US8785255B2Jul 22, 2014
Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
IBIDEN CO LTD0 citations50
US9480157B2Oct 25, 2016
Wiring board and method for manufacturing the same
IBIDEN CO LTD0 citations48
US9736945B2Aug 15, 2017
Printed wiring board
IBIDEN CO LTD0 citations40
TDK CORP
4 patentsUS10840010B2Nov 17, 2020
Coil component
TDK CORP2 citations72
US12340937B2Jun 24, 2025
Coil component and manufacturing method therefor
TDK CORP0 citations61
US11476041B2Oct 18, 2022
Coil component and manufacturing method therefor
TDK CORP1 citations59
US12051531B2Jul 30, 2024
Coil component and its manufacturing method
TDK CORP0 citations51
FURUTANI TOSHIKI
3 patentsUS8698303B2Apr 15, 2014
Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
FURUTANI TOSHIKI6 citations81
US9059187B2Jun 16, 2015
Electronic component having encapsulated wiring board and method for manufacturing the same
FURUTANI TOSHIKI2 citations62
US8546922B2Oct 1, 2013
Wiring board
FURUTANI TOSHIKI0 citations45