Inventor
YAMAHA TAKAHISA
JP34 patents
⚠️ This page may combine multiple inventors who share the name “YAMAHA TAKAHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YAMAHA CORP
29 patentsUS6297563B1Oct 2, 2001
Bonding pad structure of semiconductor device
YAMAHA CORP133 citations99
US5733797AMar 31, 1998
Method of making a semiconductor device with moisture impervious film
YAMAHA CORP74 citations96
US5763936AJun 9, 1998
Semiconductor chip capable of supressing cracks in insulating layer
YAMAHA CORP68 citations95
US7211902B2May 1, 2007
Method of forming a bonding pad structure
YAMAHA CORP13 citations92
US5885857AMar 23, 1999
Semiconductor chip capable of suppressing cracks in the insulating layer
YAMAHA CORP22 citations92
US5786638AJul 28, 1998
Semiconductor device with moisture impervious film
YAMAHA CORP18 citations92
US5750403AMay 12, 1998
Method of forming multi-layer wiring utilizing hydrogen silsesquioxane resin
YAMAHA CORP26 citations92
US5593925AJan 14, 1997
Semiconductor device capable of preventing humidity invasion
YAMAHA CORP36 citations92
US5036382AJul 30, 1991
Semiconductor device having a multi-level wiring structure
YAMAHA CORP41 citations92
US6921714B2Jul 26, 2005
Method for manufacturing a semiconductor device
YAMAHA CORP10 citations74
US6888183B1May 3, 2005
Manufacture method for semiconductor device with small variation in MOS threshold voltage
YAMAHA CORP7 citations74
US6555465B2Apr 29, 2003
Multi-layer wiring structure of integrated circuit and manufacture of multi-layer wiring
YAMAHA CORP9 citations74
US5629557AMay 13, 1997
Semiconductor device capable of preventing humidity invasion
YAMAHA CORP11 citations74
US6080652AJun 27, 2000
Method of fabricating a semiconductor device having a multi-layered wiring
YAMAHA CORP12 citations73
US5997754ADec 7, 1999
Method of fabricating multi-layered wiring
YAMAHA CORP7 citations73
US5998814ADec 7, 1999
Semiconductor device and fabrication method thereof
YAMAHA CORP12 citations73
US5904576AMay 18, 1999
Method of forming wiring structure
YAMAHA CORP10 citations73
US5821162AOct 13, 1998
Method of forming multi-layer wiring utilizing SOG
YAMAHA CORP16 citations73
US5793110AAug 11, 1998
MOS transistor with good hot carrier resistance and low interface state density
YAMAHA CORP15 citations73
US5716869AFeb 10, 1998
Method of forming a wiring layer of a semiconductor device using reflow process
YAMAHA CORP10 citations73
US5705429AJan 6, 1998
Method of manufacturing aluminum wiring at a substrate temperature from 100 to 150 degrees celsius
YAMAHA CORP11 citations73
US5641993AJun 24, 1997
Semiconductor IC with multilayered Al wiring
YAMAHA CORP14 citations73
US5428251AJun 27, 1995
Multi-layer wiring structure having continuous grain boundaries
YAMAHA CORP14 citations73
US6150720ANov 21, 2000
Semiconductor device having manufacturing wiring structure with buried plugs
YAMAHA CORP12 citations72
US6146998ANov 14, 2000
Method of manufacturing wiring structure having buried plugs in semiconductor device, and semiconductor device
YAMAHA CORP13 citations72
US5786625AJul 28, 1998
Moisture resistant semiconductor device
YAMAHA CORP6 citations63
US6251805B1Jun 26, 2001
Method of fabricating semiconductor device
YAMAHA CORP2 citations62
US6060390AMay 9, 2000
Method of forming wiring layer
YAMAHA CORP6 citations62
US6541373B2Apr 1, 2003
Manufacture method for semiconductor with small variation in MOS threshold voltage
YAMAHA CORP0 citations52