Inventor

GRASSMANN ANDREAS

DE34 patents

⚠️ This page may combine multiple inventors who share the name “GRASSMANN ANDREAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRASSMANN ANDREAS

INFINEON TECHNOLOGIES AG

Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip

Package with interconnections having different melting temperatures

Plastic cooler for semiconductor modules

Package with vertically spaced partially encapsulated contact structures

Chip carrier configured for delamination-free encapsulation and stable sintering

Power module comprising two substrates and method of manufacturing the same

Method of manufacturing a cooler for semiconductor modules

Electronic module and method of manufacturing the same

Substrate, chip arrangement, and method for manufacturing the same

Method and device for producing a housing

Package with encapsulated electronic component between laminate and thermally conductive carrier

Semiconductor panels, semiconductor packages, and methods for manufacturing thereof

Package comprising chip contact element of two different electrically conductive materials

Contact hole fabrication with the aid of mutually crossing sudden phase shift edges of a single phase shift mask

Fluid-cooled package having shielding layer

Package cooled with cooling fluid and comprising shielding layer

Package with partially encapsulated cooling channel for cooling an encapsulated chip

Package with roughened encapsulated surface for promoting adhesion

Batch manufacture of packages by sheet separated into carriers after mounting of electronic components

Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe

Printed circuit board including a leadframe with inserted packaged semiconductor chips

Power semiconductor module with current sensor

Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

Power semiconductor module and method for producing a power semiconductor module

Semiconductor module cooling system

Power semiconductor package having first and second lead frames

Semiconductor package with barrier to contain thermal interface material

Cooling techniques for semiconductor package

Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet

SIEMENS AG

Control of critical dimensions through measurement of absorbed radiation

Etching of contact holes

INFINEON TECHNOLOGIES AUSTRIA AG

Electronic switching element and integrated sensor

Power module with semiconductor packages mounted on metal frame

TOSHIBA KK

Mask blank and method of producing mask