Inventor
HAN JIANWEN
US11 patents
⚠️ This page may combine multiple inventors who share the name “HAN JIANWEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MACDERMID ENTHONE INC
6 patentsUS11035048B2Jun 15, 2021
Cobalt filling of interconnects
MACDERMID ENTHONE INC3 citations70
US11401618B2Aug 2, 2022
Cobalt filling of interconnects
MACDERMID ENTHONE INC0 citations59
US11434578B2Sep 6, 2022
Cobalt filling of interconnects in microelectronics
MACDERMID ENTHONE INC0 citations58
US10995417B2May 4, 2021
Cobalt filling of interconnects in microelectronics
MACDERMID ENTHONE INC0 citations58
US11873568B2Jan 16, 2024
Compositions and methods for the electrodeposition of nanotwinned copper
MACDERMID ENTHONE INC0 citations56
US11384446B2Jul 12, 2022
Compositions and methods for the electrodeposition of nanotwinned copper
MACDERMID ENTHONE INC1 citations56
ADVANCED TECH MATERIALS
4 patentsUS6709568B2Mar 23, 2004
Method for determining concentrations of additives in acid copper electrochemical deposition baths
ADVANCED TECH MATERIALS20 citations79
US7427344B2Sep 23, 2008
Methods for determining organic component concentrations in an electrolytic solution
ADVANCED TECH MATERIALS4 citations61
US7435320B2Oct 14, 2008
Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
ADVANCED TECH MATERIALS5 citations60
US7141156B2Nov 28, 2006
One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
ADVANCED TECH MATERIALS1 citations49