Inventor
TOWLE STEVEN
US20 patents
Patents
20 patentsUS7078788B2Jul 18, 2006
Microelectronic substrates with integrated devices
INTEL CORP223 citations99
US6841413B2Jan 11, 2005
Thinned die integrated circuit package
INTEL CORP196 citations99
US6734534B1May 11, 2004
Microelectronic substrate with integrated devices
INTEL CORP183 citations99
US6888240B2May 3, 2005
High performance, low cost microelectronic circuit package with interposer
INTEL CORP146 citations98
US6586276B2Jul 1, 2003
Method for fabricating a microelectronic device using wafer-level adhesion layer deposition
INTEL CORP122 citations98
US6555906B2Apr 29, 2003
Microelectronic package having a bumpless laminated interconnection layer
INTEL CORP273 citations98
US7189596B1Mar 13, 2007
Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures
INTEL CORP151 citations97
US7067356B2Jun 27, 2006
Method of fabricating microelectronic package having a bumpless laminated interconnection layer
INTEL CORP79 citations97
US6489185B1Dec 3, 2002
Protective film for the fabrication of direct build-up layers on an encapsulated die package
INTEL CORP81 citations97
US7183658B2Feb 27, 2007
Low cost microelectronic circuit package
INTEL CORP84 citations96
US6709898B1Mar 23, 2004
Die-in-heat spreader microelectronic package
INTEL CORP221 citations96
US6894399B2May 17, 2005
Microelectronic device having signal distribution functionality on an interfacial layer thereof
INTEL CORP130 citations95
US7071024B2Jul 4, 2006
Method for packaging a microelectronic device using on-die bond pad expansion
INTEL CORP93 citations94
US6706553B2Mar 16, 2004
Dispensing process for fabrication of microelectronic packages
INTEL CORP83 citations94
US6834133B1Dec 21, 2004
Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate
INTEL CORP41 citations93
US7888183B2Feb 15, 2011
Thinned die integrated circuit package
INTEL CORP17 citations92
US7039263B2May 2, 2006
Electrooptic assembly
INTEL CORP27 citations92
US6846737B1Jan 25, 2005
Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials
INTEL CORP24 citations92
US6838299B2Jan 4, 2005
Forming defect prevention trenches in dicing streets
INTEL CORP27 citations89
US6593650B2Jul 15, 2003
Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials
INTEL CORP5 citations74