Inventor

HUY KATJA

DE8 patents

⚠️ This page may combine multiple inventors who share the name “HUY KATJA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

4 patents

US7109086B2Sep 19, 2006

Technique for forming a spacer for a line element by using an etch stop layer deposited by a highly directional deposition technique

ADVANCED MICRO DEVICES INC11 citations83

US7005358B2Feb 28, 2006

Technique for forming recessed sidewall spacers for a polysilicon line

ADVANCED MICRO DEVICES INC9 citations73

US7442638B2Oct 28, 2008

Method for forming a tungsten interconnect structure with enhanced sidewall coverage of the barrier layer

ADVANCED MICRO DEVICES INC4 citations62

US7326646B2Feb 5, 2008

Nitrogen-free ARC layer and a method of manufacturing the same

ADVANCED MICRO DEVICES INC6 citations58

GLOBALFOUNDRIES INC

2 patents

US8847205B2Sep 30, 2014

Spacer for a gate electrode having tensile stress and a method of forming the same

GLOBALFOUNDRIES INC0 citations51

US7807233B2Oct 5, 2010

Method of forming a TEOS cap layer at low temperature and reduced deposition rate

GLOBALFOUNDRIES INC0 citations50

HUY KATJA

1 patent

US8084088B2Dec 27, 2011

Method of improving the wafer-to-wafer thickness uniformity of silicon nitride layers

HUY KATJA20 citations88

RUELKE HARTMUT

1 patent

US8557667B2Oct 15, 2013

Spacer for a gate electrode having tensile stress and a method of forming the same

RUELKE HARTMUT3 citations60