Inventor

MATSUURA TAKAO

JP9 patents

⚠️ This page may combine multiple inventors who share the name “MATSUURA TAKAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

4 patents

US6596561B2Jul 22, 2003

Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture

HITACHI LTD65 citations96

US6399423B2Jun 4, 2002

Semiconductor device an a method of manufacturing the same

HITACHI LTD35 citations95

US6667193B2Dec 23, 2003

Semiconductor device and a method of manufacturing the same

HITACHI LTD1 citations61

US6590276B2Jul 8, 2003

Semiconductor device and a method of manufacturing the same

HITACHI LTD2 citations61

RENESAS TECH CORP

2 patents

US6872597B2Mar 29, 2005

Method of manufacturing a semiconductor device and a semiconductor device

RENESAS TECH CORP13 citations92

US6723583B2Apr 20, 2004

Method of manufacturing a semiconductor device using a mold

RENESAS TECH CORP25 citations92

HITACHI YONEZAWA ELECTRONICS

2 patents

US7015069B2Mar 21, 2006

Method of manufacturing a semiconductor device and a semiconductor device

HITACHI YONEZAWA ELECTRONICS22 citations91

US6897097B2May 24, 2005

Semiconductor device and a method of manufacturing the same

HITACHI YONEZAWA ELECTRONICS2 citations60

HARADA HARUHIKO

1 patent

US8105878B2Jan 31, 2012

Manufacturing method of a semiconductor device having a package dicing

HARADA HARUHIKO0 citations42