Inventor
WAHLICH REINHOLD
DE22 patents
⚠️ This page may combine multiple inventors who share the name “WAHLICH REINHOLD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILTRONIC AG
16 patentsUS7052948B2May 30, 2006
Film or layer made of semi-conductive material and method for producing said film or layer
SILTRONIC AG23 citations91
US8039361B2Oct 18, 2011
Multilayered semiconductor wafer and process for manufacturing the same
SILTRONIC AG8 citations84
US6803331B2Oct 12, 2004
Process for the heat treatment of a silicon wafer, and silicon wafer produced
SILTRONIC AG13 citations81
US7828893B2Nov 9, 2010
Silicon wafer and process for the heat treatment of a silicon wafer
SILTRONIC AG15 citations80
US7417297B2Aug 26, 2008
Film or layer of semiconducting material, and process for producing the film or layer
SILTRONIC AG6 citations72
US7122865B2Oct 17, 2006
SOI wafer and process for producing it
SILTRONIC AG8 citations72
US7394129B2Jul 1, 2008
SOI wafer and method for producing it
SILTRONIC AG5 citations70
US7803695B2Sep 28, 2010
Semiconductor substrate and process for producing it
SILTRONIC AG3 citations62
US7491966B2Feb 17, 2009
Semiconductor substrate and process for producing it
SILTRONIC AG2 citations62
US7279700B2Oct 9, 2007
Semiconductor substrate and process for producing it
SILTRONIC AG2 citations62
US7407891B2Aug 5, 2008
Method and apparatus for leveling a semiconductor wafer, and semiconductor wafer with improved flatness
SILTRONIC AG5 citations61
US7537657B2May 26, 2009
Silicon wafer and process for producing it
SILTRONIC AG2 citations60
US7799692B2Sep 21, 2010
Method and apparatus for the treatment of a semiconductor wafer
SILTRONIC AG1 citations51
US7235863B2Jun 26, 2007
Silicon wafer and process for producing it
SILTRONIC AG0 citations49
US7988876B2Aug 2, 2011
Method for reducing and homogenizing the thickness of a semiconductor layer which lies on the surface of an electrically insulating material
SILTRONIC AG0 citations48
US7820549B2Oct 26, 2010
Layered semiconductor wafer with low warp and bow, and process for producing it
SILTRONIC AG0 citations39