Inventor

GRUNDY KEVIN P

US45 patents

⚠️ This page may combine multiple inventors who share the name “GRUNDY KEVIN P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRUNDY KEVIN P

INTERCONNECT PORTFOLIO LLC

Multi-surface IC packaging structures and methods for their manufacture

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

Interconnect system without through-holes

Torsionally-induced contact-force conductors for electrical connector systems

Signal-segregating connector system

Tapered dielectric and conductor structures and applications thereof

Torsionally-induced contact-force conductors for electrical connector systems

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

Multi-surface contact IC packaging structures and assemblies

Low profile discrete electronic components and applications of same

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

SILICON PIPE INC

Memory chain

Signal-segregating connector system

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

Memory system having a multiplexed high-speed channel

Multi-surface IC packaging structures and methods for their manufacture

Partitioned integrated circuit package with central clock driver

IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader

SAMSUNG ELECTRONICS CO LTD

Memory systems including memory devices coupled together in a daisy-chained arrangement

Tapered dielectric and conductor structures and applications thereof

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

Multi-surface IC packaging structures and methods for their manufacture

Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity

Controlled impedance structures for high density interconnections

OPSIS HEALTH INC

Sensor positioning apparatus

Appliance

Advance and hold pawl actuator

SILICON PIPE

Insulating substrate for IC packages having integral ESD protection

Stair step printed circuit board structures for high speed signal transmissions

HUGHES ELECTRONICS CORP

Method and apparatus for switching among a plurality of universal serial bus host devices

Method and apparatus providing data communication over an existing telephone network without interfering with normal telephony functions

NEXT INC

System and method for improving the performance of high-density data storage media

System and method for improving the performance of high-density data storage media

GRUNDY KEVIN P

Memory chain

ESD protection utilizing radiated thermal relief

YASUMURA GARY

Electrical connector with conductors with a ramp to induce torsion

Connector having a housing with a conductor with a ramp section and a curved surface section

FJELSTAD JOSEPH C

Low profile discrete electronic components and applications of same

Multi-surface IC packaging structures

TELOCITY INC

Method and apparatus for bridging a plurality of buses and handling of an exception event to provide bus isolation

DISH DIGITAL LLC

Indoor antenna

NOVIAS INC

Active connector

ECHOSTAR TECHNOLOGIES LLC

Modular antenna system