Inventor
CUSACK MICHAEL D
US13 patents
⚠️ This page may combine multiple inventors who share the name “CUSACK MICHAEL D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED TECHNOLOGIES CORP
5 patentsUS4711700ADec 8, 1987
Method for densifying leadframe conductor spacing
UNITED TECHNOLOGIES CORP40 citations91
US4730160AMar 8, 1988
Programmable thermal emulator test die
UNITED TECHNOLOGIES CORP26 citations90
US4875138AOct 17, 1989
Variable pitch IC bond pad arrangement
UNITED TECHNOLOGIES CORP14 citations72
US4753820AJun 28, 1988
Variable pitch IC bond pad arrangement
UNITED TECHNOLOGIES CORP18 citations72
US4959706ASep 25, 1990
Integrated circuit having an improved bond pad
UNITED TECHNOLOGIES CORP17 citations66
MARVELL INT LTD
2 patentsMARVELL INT TECHNOLOGY LTD
2 patentsUS8021928B1Sep 20, 2011
System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
MARVELL INT TECHNOLOGY LTD5 citations73
US7745263B2Jun 29, 2010
System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
MARVELL INT TECHNOLOGY LTD1 citations62