Inventor
LIM VICTOR SENG KEONG
SG16 patents
⚠️ This page may combine multiple inventors who share the name “LIM VICTOR SENG KEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
13 patentsUS6406975B1Jun 18, 2002
Method for fabricating an air gap shallow trench isolation (STI) structure
CHARTERED SEMICONDUCTOR MFG84 citations97
US7939348B2May 10, 2011
E-beam inspection structure for leakage analysis
CHARTERED SEMICONDUCTOR MFG85 citations96
US6376376B1Apr 23, 2002
Method to prevent CU dishing during damascene formation
CHARTERED SEMICONDUCTOR MFG60 citations96
US7323406B2Jan 29, 2008
Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures
CHARTERED SEMICONDUCTOR MFG23 citations92
US6649517B2Nov 18, 2003
Copper metal structure for the reduction of intra-metal capacitance
CHARTERED SEMICONDUCTOR MFG31 citations92
US6531386B1Mar 11, 2003
Method to fabricate dish-free copper interconnects
CHARTERED SEMICONDUCTOR MFG23 citations92
US6403484B1Jun 11, 2002
Method to achieve STI planarization
CHARTERED SEMICONDUCTOR MFG23 citations92
US6815823B2Nov 9, 2004
Copper metal structure for the reduction of intra-metal capacitance
CHARTERED SEMICONDUCTOR MFG13 citations84
US6673695B1Jan 6, 2004
STI scheme to prevent fox recess during pre-CMP HF dip
CHARTERED SEMICONDUCTOR MFG19 citations83
US6663472B2Dec 16, 2003
Multiple step CMP polishing
CHARTERED SEMICONDUCTOR MFG16 citations83
US7060573B2Jun 13, 2006
Extended poly buffer STI scheme
CHARTERED SEMICONDUCTOR MFG2 citations63
US6399471B1Jun 4, 2002
Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application
CHARTERED SEMICONDUCTOR MFG4 citations62
US6472697B2Oct 29, 2002
Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application
CHARTERED SEMICONDUCTOR MFG0 citations52