Inventor

CHANG CHIH-HORNG

TW34 patents

⚠️ This page may combine multiple inventors who share the name “CHANG CHIH-HORNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG CHIH-HORNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and method

Method of forming bump structure having a side recess and semiconductor structure including the same

Semiconductor structure and manufacturing method thereof

Semiconductor package and method

Bump structure having a side recess and semiconductor structure including the same

Bump structure having a side recess and semiconductor structure including the same

Treating copper surfaces for packaging

Surface treatment method and apparatus for semiconductor packaging

Surface treatment method and apparatus for semiconductor packaging

Bump structure having a side recess and semiconductor structure including the same

Bump structure having a side recess and semiconductor structure including the same

Package structure with conductive patterns in a redistribution layer

Package structure with conductive patterns in a redistribution layer

Methods of forming semiconductor packages

Surface treatment method and apparatus for semiconductor packaging

Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof

Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof

Structure and formation method of chip package with fan-out structure

Bump structure having a side recess and semiconductor structure including the same

Isolation rings for packages and the method of forming the same

Isolation rings for packages and the method of forming the same

TAIWAN SEMICONDUCTOR MFG

Bump structure having a single side recess

Bump structure having a side recess and semiconductor structure including the same

Semiconductor device having under-bump metallization (UBM) structure and method of forming the same

Treating copper surfaces for packaging

Apparatus and method for three dimensional integrated circuits

Semiconductor device having under-bump metallization (UBM) structure and method of forming the same

Isolation rings for packages and the method of forming the same

Solder mask shape for BOT laminate packages

CHANG CHIH-HORNG

Bump structures

Landing areas of bonding structures

Isolation rings for blocking the interface between package components and the respective molding compound

Thermal gradient reflow for forming columnar grain structures for solder bumps

TSAI TSUNG-FU

Under-bump metallization (UBM) structure and method of forming the same