Inventor
KO JUNGMIN
US53 patents
⚠️ This page may combine multiple inventors who share the name “KO JUNGMIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG ELECTRONICS INC
24 patentsUS10398272B2Sep 3, 2019
Vacuum cleaner
LG ELECTRONICS INC10 citations84
US11116373B2Sep 14, 2021
Cleaner
LG ELECTRONICS INC4 citations73
US11071426B2Jul 27, 2021
Vacuum cleaner
LG ELECTRONICS INC2 citations73
US10856711B2Dec 8, 2020
Vacuum cleaner
LG ELECTRONICS INC2 citations73
US10517453B2Dec 31, 2019
Dust collector and vacuum cleaner having the same
LG ELECTRONICS INC2 citations73
US10362912B2Jul 30, 2019
Vacuum cleaner
LG ELECTRONICS INC2 citations73
US10299645B2May 28, 2019
Vacuum cleaner
LG ELECTRONICS INC2 citations73
US10314448B2Jun 11, 2019
Vacuum cleaner
LG ELECTRONICS INC3 citations71
US12582275B2Mar 24, 2026
Cleaner
LG ELECTRONICS INC0 citations62
US12507855B2Dec 30, 2025
Cleaner nozzle with brush and removal member
LG ELECTRONICS INC0 citations62
US11311162B2Apr 26, 2022
Vacuum cleaner
LG ELECTRONICS INC1 citations62
US10299646B2May 28, 2019
Vacuum cleaner
LG ELECTRONICS INC1 citations62
US12082765B2Sep 10, 2024
Vacuum cleaner
LG ELECTRONICS INC0 citations61
US11944258B2Apr 2, 2024
Filter and vacuum canister cleaner
LG ELECTRONICS INC0 citations61
US11717123B2Aug 8, 2023
Vacuum cleaner
LG ELECTRONICS INC0 citations61
US11672394B2Jun 13, 2023
Cleaner
LG ELECTRONICS INC0 citations61
US11638512B2May 2, 2023
Robot cleaner
LG ELECTRONICS INC1 citations61
US11523721B2Dec 13, 2022
Vacuum cleaner
LG ELECTRONICS INC0 citations61
US10314451B2Jun 11, 2019
Vacuum cleaner
LG ELECTRONICS INC0 citations52
US10299647B2May 28, 2019
Vacuum cleaner
LG ELECTRONICS INC0 citations52
US10271702B2Apr 30, 2019
Vacuum cleaner
LG ELECTRONICS INC0 citations52
US12564300B2Mar 3, 2026
Cleaner
LG ELECTRONICS INC0 citations51
US12478233B2Nov 25, 2025
Nozzle part and robot cleaner including same
LG ELECTRONICS INC0 citations51
US12232685B2Feb 25, 2025
Cleaner
LG ELECTRONICS INC0 citations50
APPLIED MATERIALS INC
14 patentsUS9293568B2Mar 22, 2016
Method of fin patterning
APPLIED MATERIALS INC150 citations99
US9543163B2Jan 10, 2017
Methods for forming features in a material layer utilizing a combination of a main etching and a cyclical etching process
APPLIED MATERIALS INC114 citations97
US9478433B1Oct 25, 2016
Cyclic spacer etching process with improved profile control
APPLIED MATERIALS INC109 citations97
US10026621B2Jul 17, 2018
SiN spacer profile patterning
APPLIED MATERIALS INC93 citations96
US10403507B2Sep 3, 2019
Shaped etch profile with oxidation
APPLIED MATERIALS INC2 citations73
US9520302B2Dec 13, 2016
Methods for controlling Fin recess loading
APPLIED MATERIALS INC3 citations73
US10424487B2Sep 24, 2019
Atomic layer etching processes
APPLIED MATERIALS INC3 citations72
US9721807B2Aug 1, 2017
Cyclic spacer etching process with improved profile control
APPLIED MATERIALS INC4 citations72
US10629473B2Apr 21, 2020
Footing removal for nitride spacer
APPLIED MATERIALS INC1 citations62
US10600639B2Mar 24, 2020
SiN spacer profile patterning
APPLIED MATERIALS INC1 citations61
US10062575B2Aug 28, 2018
Poly directional etch by oxidation
APPLIED MATERIALS INC1 citations52
US9368369B2Jun 14, 2016
Methods for forming a self-aligned contact via selective lateral etch
APPLIED MATERIALS INC1 citations52
US11437242B2Sep 6, 2022
Selective removal of silicon-containing materials
APPLIED MATERIALS INC0 citations51
US10242908B2Mar 26, 2019
Airgap formation with damage-free copper
APPLIED MATERIALS INC0 citations45
SAMSUNG ELECTRONICS CO LTD
11 patentsUS11257794B2Feb 22, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations68
US11721601B2Aug 8, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US12154881B2Nov 26, 2024
Integrated circuit device having redistribution pattern
SAMSUNG ELECTRONICS CO LTD0 citations58
US11658160B2May 23, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US11640951B2May 2, 2023
Integrated circuit device having redistribution pattern
SAMSUNG ELECTRONICS CO LTD0 citations58
US11469099B2Oct 11, 2022
Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages
SAMSUNG ELECTRONICS CO LTD0 citations58
US11869751B2Jan 9, 2024
Upper electrode and substrate processing apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US11545344B2Jan 3, 2023
Upper electrode and substrate processing apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US11756935B2Sep 12, 2023
Chip-stacked semiconductor package with increased package reliability
SAMSUNG ELECTRONICS CO LTD0 citations46
US12494352B2Dec 9, 2025
Plasma confinement ring, semiconductor manufacturing apparatus including the same, and method of manufacturing a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations45
US12424582B2Sep 23, 2025
Semiconductor package including a plurality of semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations42
JI BING
1 patentShowing the top 50 of 53 patents by PatentIndex Score.