Inventor
CHOI TOM
US21 patents
⚠️ This page may combine multiple inventors who share the name “CHOI TOM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
12 patentsUS9478433B1Oct 25, 2016
Cyclic spacer etching process with improved profile control
APPLIED MATERIALS INC109 citations97
US10026621B2Jul 17, 2018
SiN spacer profile patterning
APPLIED MATERIALS INC93 citations96
US10403507B2Sep 3, 2019
Shaped etch profile with oxidation
APPLIED MATERIALS INC2 citations73
US10424487B2Sep 24, 2019
Atomic layer etching processes
APPLIED MATERIALS INC3 citations72
US9721807B2Aug 1, 2017
Cyclic spacer etching process with improved profile control
APPLIED MATERIALS INC4 citations72
US9818621B2Nov 14, 2017
Cyclic oxide spacer etch process
APPLIED MATERIALS INC2 citations67
US10629473B2Apr 21, 2020
Footing removal for nitride spacer
APPLIED MATERIALS INC1 citations62
US10600639B2Mar 24, 2020
SiN spacer profile patterning
APPLIED MATERIALS INC1 citations61
US10062575B2Aug 28, 2018
Poly directional etch by oxidation
APPLIED MATERIALS INC1 citations52
US10490406B2Nov 26, 2019
Systems and methods for material breakthrough
APPLIED MATERIALS INC0 citations51
US12374584B2Jul 29, 2025
Multi color stack for self aligned dual pattern formation for multi purpose device structures
APPLIED MATERIALS INC0 citations50
US10354889B2Jul 16, 2019
Non-halogen etching of silicon-containing materials
APPLIED MATERIALS INC0 citations41
LAM RES CORP
6 patentsUS6514378B1Feb 4, 2003
Method for improving uniformity and reducing etch rate variation of etching polysilicon
LAM RES CORP36 citations92
US6531029B1Mar 11, 2003
Vacuum plasma processor apparatus and method
LAM RES CORP15 citations83
US7782591B2Aug 24, 2010
Methods of and apparatus for reducing amounts of particles on a wafer during wafer de-chucking
LAM RES CORP9 citations82
US8906810B2Dec 9, 2014
Pulsed dielectric etch process for in-situ metal hard mask shape control to enable void-free metallization
LAM RES CORP7 citations81
US6897156B2May 24, 2005
Vacuum plasma processor method
LAM RES CORP1 citations51
US7479457B2Jan 20, 2009
Gas mixture for removing photoresist and post etch residue from low-k dielectric material and method of use thereof
LAM RES CORP1 citations50