Inventor
KANG SEAN
US26 patents
⚠️ This page may combine multiple inventors who share the name “KANG SEAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
16 patentsUS9478433B1Oct 25, 2016
Cyclic spacer etching process with improved profile control
APPLIED MATERIALS INC109 citations97
US10622214B2Apr 14, 2020
Tungsten defluorination by high pressure treatment
APPLIED MATERIALS INC15 citations94
US10847360B2Nov 24, 2020
High pressure treatment of silicon nitride film
APPLIED MATERIALS INC15 citations86
US10049927B2Aug 14, 2018
Seam-healing method upon supra-atmospheric process in diffusion promoting ambient
APPLIED MATERIALS INC14 citations84
US9520302B2Dec 13, 2016
Methods for controlling Fin recess loading
APPLIED MATERIALS INC3 citations73
US10424487B2Sep 24, 2019
Atomic layer etching processes
APPLIED MATERIALS INC3 citations72
US9721807B2Aug 1, 2017
Cyclic spacer etching process with improved profile control
APPLIED MATERIALS INC4 citations72
US11495470B1Nov 8, 2022
Method of enhancing etching selectivity using a pulsed plasma
APPLIED MATERIALS INC2 citations68
US12593627B2Mar 31, 2026
Tungsten defluorination by high pressure treatment
APPLIED MATERIALS INC0 citations62
US11705337B2Jul 18, 2023
Tungsten defluorination by high pressure treatment
APPLIED MATERIALS INC0 citations62
US9299577B2Mar 29, 2016
Methods for etching a dielectric barrier layer in a dual damascene structure
APPLIED MATERIALS INC2 citations62
US12278110B2Apr 15, 2025
Bias voltage modulation approach for SiO/SiN layer alternating etch process
APPLIED MATERIALS INC0 citations53
US10062575B2Aug 28, 2018
Poly directional etch by oxidation
APPLIED MATERIALS INC1 citations52
US9514953B2Dec 6, 2016
Methods for barrier layer removal
APPLIED MATERIALS INC1 citations52
US9368369B2Jun 14, 2016
Methods for forming a self-aligned contact via selective lateral etch
APPLIED MATERIALS INC1 citations52
US10242908B2Mar 26, 2019
Airgap formation with damage-free copper
APPLIED MATERIALS INC0 citations45
LAM RES CORP
5 patentsUS6909195B2Jun 21, 2005
Trench etch process for low-k dielectrics
LAM RES CORP16 citations91
US7892445B1Feb 22, 2011
Wafer electrical discharge control using argon free dechucking gas
LAM RES CORP23 citations90
US7782591B2Aug 24, 2010
Methods of and apparatus for reducing amounts of particles on a wafer during wafer de-chucking
LAM RES CORP9 citations82
US6794293B2Sep 21, 2004
Trench etch process for low-k dielectrics
LAM RES CORP14 citations82
US6979579B1Dec 27, 2005
Methods and apparatus for inspecting contact openings in a plasma processing system
LAM RES CORP6 citations61