Inventor

NEMANI SRINIVAS D

US200 patents

⚠️ This page may combine multiple inventors who share the name “NEMANI SRINIVAS D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEMANI SRINIVAS D

APPLIED MATERIALS INC

Spacer formation

Method for depositing and curing low-k films for gapfill and conformal film applications

Two-layer film for next generation damascene barrier application with good oxidation resistance

Method and system for improving dielectric film quality for void free gap fill

Development of high etch selective hardmask material by ion implantation into amorphous carbon films

Halogen-free gas-phase silicon etch

Methods for etching an etching stop layer utilizing a cyclical etching process

Delicate dry clean

Methods for forming a silicon oxide layer over a substrate

Deposition-plasma cure cycle process to enhance film quality of silicon dioxide

High quality silicon oxide films by remote plasma CVD from disilane precursors

Curing methods for silicon dioxide multi-layers

Curing methods for silicon dioxide thin films deposited from alkoxysilane precursor with harp II process

Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes

Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power

Method of depositing dielectric films

Methods for forming features in a material layer utilizing a combination of a main etching and a cyclical etching process

Cyclic spacer etching process with improved profile control

Air gap process

Method of patterning a silicon nitride dielectric film

Method of patterning a low-k dielectric film

Silicon oxide recess etch

Method of depositing dielectric materials in damascene applications

Integrated process modulation (IPM) a novel solution for gapfill with HDP-CVD

Method and apparatus for post exposure processing of photoresist wafers

Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD)

Gas delivery module

Silicon oxide gapfill deposition using liquid precursors

Method for depositing a low dielectric constant film

Side wall passivation films for damascene cu/low k electronic devices

Method of depositing organosillicate layers

Apparatus and methods for spacer deposition and selective removal in an advanced patterning process

Post deposition plasma treatment to increase tensile stress of HDP-CVD SIO2

Method for cleaning a process chamber

Use of cyclic siloxanes for hardness improvement of low k dielectric films

Method for forming ultra low k films using electron beam

High pressure treatment of silicon nitride film

Method to fabricate thermally stable low K-FinFET spacer

Seam-healing method upon supra-atmospheric process in diffusion promoting ambient

Integrated cluster tool for selective area deposition

Methods for fabricating nanowire for semiconductor applications

Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom

Methods of forming metal silicide layers and metal silicide layers formed therefrom

MICROMATERIALS LLC

Gas delivery system for high pressure processing chamber

High pressure wafer processing systems and related methods

High pressure wafer processing systems and related methods

Gas delivery system for high pressure processing chamber

NEMANI SRINIVAS D

Method of patterning a low-k dielectric film

MALLICK ABHIJIT BASU

High quality silicon oxide films by remote plasma CVD from disilane precursors

LUBOMIRSKY DMITRY

Dielectric deposition and etch back processes for bottom up gapfill