Inventor
HIROSE YOSHIRO
JP149 patents
⚠️ This page may combine multiple inventors who share the name “HIROSE YOSHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
32 patentsUS10026607B2Jul 17, 2018
Substrate processing apparatus for forming film including at least two different elements
HITACHI INT ELECTRIC INC8 citations92
US9312123B2Apr 12, 2016
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC6 citations92
US7884034B2Feb 8, 2011
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC20 citations89
US9865451B2Jan 9, 2018
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC8 citations84
US9613798B2Apr 4, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC8 citations84
US9508543B2Nov 29, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC10 citations84
US9472391B2Oct 18, 2016
Semiconductor device manufacturing method
HITACHI INT ELECTRIC INC11 citations84
US9443718B2Sep 13, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC11 citations84
US9384971B2Jul 5, 2016
Method of manufacturing semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC5 citations84
US9385013B2Jul 5, 2016
Method and apparatus of manufacturing a semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC5 citations84
US9384972B2Jul 5, 2016
Method of manufacturing semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC5 citations84
US9384968B2Jul 5, 2016
Method of manufacturing a semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC5 citations84
US9349586B2May 24, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC8 citations84
US9330904B2May 3, 2016
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC5 citations84
US9257275B2Feb 9, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC7 citations84
US9218959B2Dec 22, 2015
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC6 citations84
US9190298B2Nov 17, 2015
Film forming method and recording medium for performing the method
HITACHI INT ELECTRIC INC5 citations84
US9093270B2Jul 28, 2015
Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC11 citations84
US9053927B2Jun 9, 2015
Method of manufacturing semiconductor device and method of processing substrate
HITACHI INT ELECTRIC INC11 citations84
US9054046B2Jun 9, 2015
Method of manufacturing semiconductor device and method of processing substrate
HITACHI INT ELECTRIC INC10 citations84
US8809204B2Aug 19, 2014
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC4 citations84
US9620357B2Apr 11, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC8 citations83
US9384966B2Jul 5, 2016
Method of manufacturing a semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC2 citations74
US9384969B2Jul 5, 2016
Method of manufacturing semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC2 citations74
US9384967B2Jul 5, 2016
Method of manufacturing a semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC2 citations74
US9384970B2Jul 5, 2016
Method of manufacturing semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC2 citations74
US10340134B2Jul 2, 2019
Semiconductor device manufacturing method, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC5 citations73
US10128104B2Nov 13, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC2 citations73
US9890458B2Feb 13, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations73
US9816181B2Nov 14, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations73
US9793107B2Oct 17, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC4 citations73
US9732426B2Aug 15, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC2 citations73
AKAE NAONORI
4 patentsUS8415258B2Apr 9, 2013
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
AKAE NAONORI480 citations98
US8076251B2Dec 13, 2011
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
AKAE NAONORI489 citations98
US8609551B2Dec 17, 2013
Method for manufacturing semiconductor device and substrate processing apparatus
AKAE NAONORI6 citations84
US8895457B2Nov 25, 2014
Method of manufacturing semiconductor device and substrate processing apparatus
AKAE NAONORI7 citations83
HITACHI-KOKUSAI ELECTRIC INC
4 patentsUS9443720B2Sep 13, 2016
Method of manufacturing semiconductor device for forming film including at least two different elements
HITACHI-KOKUSAI ELECTRIC INC6 citations92
US9487861B2Nov 8, 2016
Substrate processing apparatus capable of forming films including at least two different elements
HITACHI-KOKUSAI ELECTRIC INC4 citations83
US9478417B2Oct 25, 2016
Method of manufacturing semiconductor device for forming film including at least two different elements
HITACHI-KOKUSAI ELECTRIC INC4 citations83
US9443719B2Sep 13, 2016
Method of manufacturing semiconductor device for forming film including at least two different elements
HITACHI-KOKUSAI ELECTRIC INC4 citations83
HIROSE YOSHIRO
3 patentsUS9165761B2Oct 20, 2015
Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording medium
HIROSE YOSHIRO9 citations83
US9018104B2Apr 28, 2015
Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatus
HIROSE YOSHIRO8 citations83
US8546272B2Oct 1, 2013
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
HIROSE YOSHIRO6 citations83
HOYA CORP
1 patentHOWA MACHINERY LTD
1 patentTAKASAWA YUSHIN
1 patentSASAJIMA RYOTA
1 patentOTA YOSUKE
1 patentHITACHI KOKOSAI ELECTRIC INC
1 patentKOKUSAI ELECTRIC CORP
1 patentShowing the top 50 of 149 patents by PatentIndex Score.