Inventor
SAKUMA TAKASHI
JP45 patents
⚠️ This page may combine multiple inventors who share the name “SAKUMA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
15 patentsUS8029873B2Oct 4, 2011
Film deposition method and film deposition apparatus of metal film
TOKYO ELECTRON LTD7 citations84
US9425093B2Aug 23, 2016
Copper wiring forming method, film forming system, and storage medium
TOKYO ELECTRON LTD2 citations63
US8026176B2Sep 27, 2011
Film forming method, plasma film forming apparatus and storage medium
TOKYO ELECTRON LTD6 citations63
US7935393B2May 3, 2011
Method and system for improving sidewall coverage in a deposition system
TOKYO ELECTRON LTD3 citations63
US11626290B2Apr 11, 2023
Method, device, and system for etching silicon oxide film
TOKYO ELECTRON LTD1 citations62
US11993841B2May 28, 2024
Substrate processing method and substrate processing apparatus
TOKYO ELECTRON LTD0 citations52
US9362166B2Jun 7, 2016
Method of forming copper wiring
TOKYO ELECTRON LTD1 citations52
US9984892B2May 29, 2018
Oxide film removing method, oxide film removing apparatus, contact forming method, and contact forming system
TOKYO ELECTRON LTD1 citations51
US9406558B2Aug 2, 2016
Cu wiring fabrication method and storage medium
TOKYO ELECTRON LTD1 citations51
US12456605B2Oct 28, 2025
Plasma processing apparatus and plasma processing method
TOKYO ELECTRON LTD0 citations50
US12347676B2Jul 1, 2025
Substrate processing method and substrate processing system
TOKYO ELECTRON LTD0 citations49
US10096548B2Oct 9, 2018
Method of manufacturing Cu wiring
TOKYO ELECTRON LTD0 citations42
US9406557B2Aug 2, 2016
Copper wiring forming method with Ru liner and Cu alloy fill
TOKYO ELECTRON LTD0 citations39
US9253862B2Feb 2, 2016
Plasma processing method and plasma processing apparatus
TOKYO ELECTRON LTD0 citations38
US10242878B2Mar 26, 2019
Substrate processing method and recording medium
TOKYO ELECTRON LTD0 citations36
EBARA CORP
5 patentsUS10388419B2Aug 20, 2019
Adsorbent for adsorbing iodine compounds and/or antimony, method for preparing said adsorbent, and method and apparatus for treating radioactive waste liquid by using said absorbent
EBARA CORP5 citations73
US11213799B2Jan 4, 2022
Adsorbent for radioactive antimony, radioactive iodine and radioactive ruthenium, and treatment method of radioactive waste water using the adsorbent
EBARA CORP2 citations68
US11400432B2Aug 2, 2022
Silicotitanate molded body, production method thereof, adsorbent for cesium and/or strontium comprising silicotitanate molded body, and decontamination method for radioactive waste solution by using adsorbent
EBARA CORP0 citations60
US11446631B2Sep 20, 2022
Alkaline earth metal ion adsorbent, and production method of the same, and alkaline earth metal ion-containing liquid treatment apparatus
EBARA CORP0 citations59
US11110430B2Sep 7, 2021
Treatment method of radioactive iodine-containing fluid
EBARA CORP0 citations51
ISHIZAKA TADAHIRO
2 patentsFUJITSU SEMICONDUCTOR LTD
2 patentsMASUMOTO TSUYOSHI
2 patentsOMRON TATEISI ELECTRONICS CO
2 patentsUS10705500B2Jul 7, 2020
Support device, method, and recording medium for simplifying control program changing operation
OMRON TATEISI ELECTRONICS CO2 citations71
US11409256B2Aug 9, 2022
Information processing device, information processing method and non-transitory computer-readable storage medium for synchronizing edited content of control programs
OMRON TATEISI ELECTRONICS CO2 citations68