Inventor

CHUNG KEE-WEI

TW2 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG KEE-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG KEE WEI

1 patent

US8455984B2Jun 4, 2013

Integrated circuit structure and method of forming the same

CHUNG KEE WEI2 citations51

POWERTECH TECHNOLOGY INC

1 patent

US9972554B2May 15, 2018

Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof

POWERTECH TECHNOLOGY INC0 citations37