Inventor
PALMATIER PHILLIP W
US16 patents
⚠️ This page may combine multiple inventors who share the name “PALMATIER PHILLIP W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS6080289AJun 27, 2000
Electroplating apparatus with self-cleaning contacts
IBM19 citations91
US5869139AFeb 9, 1999
Apparatus and method for plating pin grid array packaging modules
IBM40 citations88
US9278401B2Mar 8, 2016
Fill head interface with combination vacuum pressure chamber
IBM5 citations72
US7833897B2Nov 16, 2010
Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface
IBM7 citations71
US6077405AJun 20, 2000
Method and apparatus for making electrical contact to a substrate during electroplating
IBM11 citations71
US11053604B2Jul 6, 2021
System for treating solution for use in electroplating application and method for treating solution for use in electroplating application
IBM0 citations60
US10895017B2Jan 19, 2021
Prevent and remove organics from reservoir wells
IBM0 citations60
US10450667B2Oct 22, 2019
System for treating solution for use in electroplating application and method for treating solution for use in electroplating application
IBM1 citations60
US10718062B2Jul 21, 2020
Prevent and remove organics from reservoir wells
IBM0 citations50
US10392720B2Aug 27, 2019
Prevent and remove organics from reservoir wells
IBM0 citations50
US10087546B2Oct 2, 2018
Prevent and remove organics from reservoir wells
IBM0 citations50
US6241868B1Jun 5, 2001
Method for electroplating a film onto a substrate
IBM0 citations49
US9428841B2Aug 30, 2016
Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solution
IBM0 citations36
GLOBALFOUNDRIES INC
2 patentsUS10053794B2Aug 21, 2018
Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution
GLOBALFOUNDRIES INC0 citations50
US9777388B2Oct 3, 2017
Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution
GLOBALFOUNDRIES INC0 citations50