Inventor
MIAO CHIA-CHUN
TW43 patents
⚠️ This page may combine multiple inventors who share the name “MIAO CHIA-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
25 patentsUS9806045B2Oct 31, 2017
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9698079B2Jul 4, 2017
Barrier structures between external electrical connectors
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9543373B2Jan 10, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US11101238B2Aug 24, 2021
Surface mounting semiconductor components
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10157900B2Dec 18, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9559071B2Jan 31, 2017
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11894330B2Feb 6, 2024
Methods of manufacturing a semiconductor device including a joint adjacent to a post
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10971463B2Apr 6, 2021
Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10720495B2Jul 21, 2020
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US10049990B2Aug 14, 2018
Solder ball protection in packages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12218035B2Feb 4, 2025
Barrier structures between external electrical connectors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11296012B2Apr 5, 2022
Barrier structures between external electrical connectors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10985117B2Apr 20, 2021
Solder ball protection in packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867957B2Dec 15, 2020
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510689B2Dec 17, 2019
Solder ball protection in packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10347563B2Jul 9, 2019
Barrier structures between external electrical connectors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269588B2Apr 23, 2019
Integrated circuit underfill scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163846B2Dec 25, 2018
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10037959B2Jul 31, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9953966B2Apr 24, 2018
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9941240B2Apr 10, 2018
Semiconductor chip scale package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9472523B2Oct 18, 2016
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9460989B2Oct 4, 2016
Interposer having a defined through via pattern
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9653341B2May 16, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
US9627325B2Apr 18, 2017
Package alignment structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
OMNIVISION TECH INC
11 patentsUS9590005B1Mar 7, 2017
High dynamic range image sensor with reduced sensitivity to high intensity light
OMNIVISION TECH INC14 citations84
US10892290B2Jan 12, 2021
Interconnect layer contact and method for improved packaged integrated circuit reliability
OMNIVISION TECH INC5 citations73
US10418408B1Sep 17, 2019
Curved image sensor using thermal plastic substrate material
OMNIVISION TECH INC4 citations73
US9966396B2May 8, 2018
High dynamic range image sensor with reduced sensitivity to high intensity light
OMNIVISION TECH INC3 citations73
US9608023B1Mar 28, 2017
Edge reflection reduction
OMNIVISION TECH INC3 citations73
US11195864B2Dec 7, 2021
Flip-chip sample imaging devices with self-aligning lid
OMNIVISION TECH INC0 citations62
US10297627B1May 21, 2019
Chip scale package for an image sensor
OMNIVISION TECH INC1 citations62
US10211243B2Feb 19, 2019
Edge reflection reduction
OMNIVISION TECH INC0 citations52
US10147751B2Dec 4, 2018
Edge reflection reduction
OMNIVISION TECH INC0 citations52
US9966404B2May 8, 2018
Edge reflection reduction
OMNIVISION TECH INC0 citations52
US9921442B2Mar 20, 2018
Method for forming an alignment layer of a liquid crystal display device and display device manufactured thereby
OMNIVISION TECH INC1 citations51
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9337154B2May 10, 2016
Semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG14 citations84
US9263405B2Feb 16, 2016
Semiconductor device
TAIWAN SEMICONDUCTOR MFG3 citations73
US9064873B2Jun 23, 2015
Singulated semiconductor structure
TAIWAN SEMICONDUCTOR MFG3 citations63
US9355924B2May 31, 2016
Integrated circuit underfill scheme
TAIWAN SEMICONDUCTOR MFG0 citations52
US9184143B2Nov 10, 2015
Semiconductor device with bump adjustment and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG0 citations52