Inventor

LEE BONGSUB

US20 patents

⚠️ This page may combine multiple inventors who share the name “LEE BONGSUB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE BONGSUB

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Metal pads over TSV

TSV as pad

Offset pads over TSV

Offset pads over TSV

TSV as pad

Structures for bonding elements including conductive interface features

Metal pads over TSV

Directly bonded metal structures having oxide layers therein

Expansion controlled structure for direct bonding and method of forming same

INVENSAS CORP

Wafer-level packaging using wire bond wires in place of a redistribution layer

Fan-out wafer-level packaging using metal foil lamination

Wafer level packages with mechanically decoupled fan-in and fan-out areas

Nanoscale interconnect array for stacked dies

Nanoscale interconnect array for stacked dies

Fan-out wafer-level packaging using metal foil lamination

Wafer-level packaging using wire bond wires in place of a redistribution layer

Methods and structures to repair device warpage

INVENSAS BONDING TECH INC

Offset pads over TSV

Large metal pads over TSV

Bonded structures