P

Inventor

AWATA HIDEAKI

JP13 patents
⚠️ This page may combine multiple inventors who share the name “AWATA HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUMITOMO ELECTRIC INDUSTRIES

11 patents
US7871667B2Jan 18, 2011

Method of operating vacuum deposition apparatus and vacuum deposition apparatus

SUMITOMO ELECTRIC INDUSTRIES7 citations81
US10655213B2May 19, 2020

Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor device

SUMITOMO ELECTRIC INDUSTRIES2 citations71
US10475631B2Nov 12, 2019

Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device

SUMITOMO ELECTRIC INDUSTRIES3 citations71
US10087517B2Oct 2, 2018

Oxide sintered body and semiconductor device

SUMITOMO ELECTRIC INDUSTRIES4 citations71
US10894744B2Jan 19, 2021

Oxide sintered material and method for manufacturing the same, sputtering target, and method for manufacturing semiconductor device

SUMITOMO ELECTRIC INDUSTRIES0 citations57
US11492694B2Nov 8, 2022

Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor device

SUMITOMO ELECTRIC INDUSTRIES0 citations50
US11024744B2Jun 1, 2021

Semiconductor device and method for manufacturing the same

SUMITOMO ELECTRIC INDUSTRIES0 citations50
US10822276B2Nov 3, 2020

Oxide sintered material and method of manufacturing the same, sputtering target, and method of manufacturing semiconductor device

SUMITOMO ELECTRIC INDUSTRIES0 citations50
US10811238B2Oct 20, 2020

Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device

SUMITOMO ELECTRIC INDUSTRIES0 citations50
US10192994B2Jan 29, 2019

Oxide semiconductor film including indium, tungsten and zinc and thin film transistor device

SUMITOMO ELECTRIC INDUSTRIES0 citations50
US7946247B2May 24, 2011

Coating layer thickness measurement mechanism and coating layer forming apparatus using the same

SUMITOMO ELECTRIC INDUSTRIES1 citations49

EMURA KATSUJI

1 patent

MITSUI MINING & SMELTING CO LTD

1 patent