P

Inventor

CHANG YU-HSING

TW34 patents
⚠️ This page may combine multiple inventors who share the name “CHANG YU-HSING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

31 patents
US9178144B1Nov 3, 2015

RRAM cell with bottom electrode

TAIWAN SEMICONDUCTOR MFG CO LTD25 citations93
US10134748B2Nov 20, 2018

Cell boundary structure for embedded memory

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations92
US11575052B2Feb 7, 2023

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US10804411B2Oct 13, 2020

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10734394B2Aug 4, 2020

Cell boundary structure for embedded memory

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10535671B2Jan 14, 2020

Cell boundary structure for embedded memory

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9620372B2Apr 11, 2017

HK embodied flash memory and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9570454B2Feb 14, 2017

Structure with emedded EFS3 and FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US11973149B2Apr 30, 2024

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11361971B2Jun 14, 2022

High aspect ratio Bosch deep etch

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9954100B2Apr 24, 2018

Method and apparatus for high voltate transistors

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9768220B2Sep 19, 2017

Deep trench isolation structure for image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US9257571B1Feb 9, 2016

Memory gate first approach to forming a split gate flash memory cell device

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11640971B2May 2, 2023

Deep trench capacitor including self-aligned plate contact via structures and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations67
US12289979B2Apr 29, 2025

Deposition system for high accuracy patterning

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11818944B2Nov 14, 2023

Deposition system for high accuracy patterning

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9425044B2Aug 23, 2016

Composite spacer for silicon nanocrystal memory storage

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US9356142B2May 31, 2016

Pattern layout to prevent split gate flash memory cell failure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12471431B2Nov 11, 2025

Hard mask layer below via structure in display device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12456677B2Oct 28, 2025

Via landing on first and second barrier layers to reduce cleaning time of conductive structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12446238B2Oct 14, 2025

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12406851B2Sep 2, 2025

High aspect ratio bosch deep etch

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11810907B2Nov 7, 2023

Pixel structure for displays

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776901B2Oct 3, 2023

Via landing on first and second barrier layers to reduce cleaning time of conductive structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11682692B2Jun 20, 2023

Hard mask layer below via structure in display device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11296100B2Apr 5, 2022

Cell boundary structure for embedded memory

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10461089B2Oct 29, 2019

Cell boundary structure for embedded memory

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10121805B2Nov 6, 2018

Semiconductor structure and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10026741B2Jul 17, 2018

Logic-compatible memory cell manufacturing method and structure thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9653471B2May 16, 2017

Pattern layout to prevent split gate flash memory cell failure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9287279B2Mar 15, 2016

Silicon nitride (SiN) encapsulating layer for silicon nanocrystal memory storage

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

TAIWAN SEMICONDUCTOR MFG

2 patents

HONG MING-HWEI

1 patent