Inventor

VISWANATH RAM S

US25 patents

⚠️ This page may combine multiple inventors who share the name “VISWANATH RAM S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VISWANATH RAM S

INTEL CORP

Pickup chuck with an integral heat pipe

Pickup chuck with an integral heatsink

Computer utilizing refrigeration for cooling

Thermally enhanced test socket

Thermally enhanced test contactor

Interconnect architecture with silicon interposer and EMIB

CPU package substrates with removable memory mechanical interfaces

Integrated circuit connectors

Mold shelf package design and process flow for advanced package architectures

Thermal design for minimizing interface in a multi-site thermal contact condition

Printed circuit board with a recess to accommodate discrete components in a package

No mold shelf package design and process flow for advanced package architectures

No mold shelf package design and process flow for advanced package architectures

Rlink—die to die channel interconnect configurations to improve signaling

Integrated circuit structures with recessed conductive contacts for package on package

Integrated circuit structures with recessed conductive contacts for package on package

3D integrated circuit package with window interposer

Interconnect architecture with silicon interposer and EMIB

Interconnect architecture with silicon interposer and EMIB

Methods of forming ultra thin package structures including low temperature solder and structures formed therby

Low profile zero/low insertion force package top side flex cable connector architecture

Methods of forming ultra thin package structures including low temperature solder and structures formed therby

GANESAN SANKA

Package-on-package interconnect stiffener

Low profile zero/low insertion force package top side flex cable connector architecture

MALLIK DEBENDRA

3D integrated circuit package with window interposer