Inventor
MURTAGIAN GREGORIO R
US15 patents
⚠️ This page may combine multiple inventors who share the name “MURTAGIAN GREGORIO R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
13 patentsUS10056182B2Aug 21, 2018
Surface-mount inductor structures for forming one or more inductors with substrate traces
INTEL CORP7 citations83
US9832876B2Nov 28, 2017
CPU package substrates with removable memory mechanical interfaces
INTEL CORP7 citations83
US11291133B2Mar 29, 2022
Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
INTEL CORP2 citations72
US10431912B2Oct 1, 2019
CPU socket contact for improving bandwidth throughput
INTEL CORP6 citations72
US9692147B1Jun 27, 2017
Small form factor sockets and connectors
INTEL CORP5 citations72
US11804456B2Oct 31, 2023
Wirebond and leadframe magnetic inductors
INTEL CORP0 citations61
US11737227B2Aug 22, 2023
Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
INTEL CORP0 citations61
US11818832B2Nov 14, 2023
Socket load regulation utilizing CPU carriers with shim components
INTEL CORP0 citations60
US12174436B2Dec 24, 2024
Package expanded beam connector for on-package optics
INTEL CORP0 citations59
US10396036B2Aug 27, 2019
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices
INTEL CORP0 citations51
US9461431B2Oct 4, 2016
Mechanism for facilitating and employing a magnetic grid array
INTEL CORP0 citations49
US10321573B2Jun 11, 2019
Solder contacts for socket assemblies
INTEL CORP0 citations48
US9860988B2Jan 2, 2018
Solder contacts for socket assemblies
INTEL CORP0 citations48