Inventor
LIU KUANG C
US8 patents
Patents
8 patentsUS9832876B2Nov 28, 2017
CPU package substrates with removable memory mechanical interfaces
INTEL CORP7 citations83
US11291133B2Mar 29, 2022
Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
INTEL CORP2 citations72
US9615483B2Apr 4, 2017
Techniques and configurations associated with a package load assembly
INTEL CORP3 citations72
US9825387B2Nov 21, 2017
Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion
INTEL CORP3 citations70
US11737227B2Aug 22, 2023
Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
INTEL CORP0 citations61
US10186497B2Jan 22, 2019
Techniques and configurations to control movement and position of surface mounted electrical devices
INTEL CORP0 citations50
US9647363B2May 9, 2017
Techniques and configurations to control movement and position of surface mounted electrical devices
INTEL CORP1 citations50
US10680367B2Jun 9, 2020
Cable retention assemblies including torsional elements
INTEL CORP0 citations49