Inventor

SWAMINATHAN RAJASEKARAN

US45 patents

⚠️ This page may combine multiple inventors who share the name “SWAMINATHAN RAJASEKARAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SWAMINATHAN RAJASEKARAN

INTEL CORP

Interconnect cable with edge finger connector

Interconnect cable with edge finger connector

Magnetic attachment structure

Attachment using magnetic particle based solder composites

Ultra-thin, hyper-density semiconductor packages

Pitch translation architecture for semiconductor package including embedded interconnect bridge

CPU package substrates with removable memory mechanical interfaces

Integrated circuit connectors

Magnetic particle-based composite materials for semiconductor packages

Printed circuit board with a recess to accommodate discrete components in a package

Pitch translation architecture for semiconductor package including embedded interconnect bridge

Pitch translation architecture for semiconductor package including embedded interconnect bridge

Rlink—die to die channel interconnect configurations to improve signaling

Pitch translation architecture for semiconductor package including embedded interconnect bridge

Chip package connector assembly

Techniques and configurations associated with a package load assembly

Electronic package with narrow-factor via including finish layer

BGA STIM package architecture for high performance systems

Multiple die package using an embedded bridge connecting dies

Ultra-thin, hyper-density semiconductor packages

Ultra-thin, hyper-density semiconductor packages

Pitch translation architecture for semiconductor package including embedded interconnect bridge

Forming sacrificial composite materials for package-on-package architectures and structures formed thereby

Methods of forming ultra thin package structures including low temperature solder and structures formed therby

Flip chip package containing novel underfill materials

Multiple die package using an embedded bridge connecting dies

Chip with magnetic interconnect alignment

Magnetic intermetallic compound interconnect

Snap connector for socket assembly and associated techniques and configurations

Forming sacrificial composite materials for package-on-package architectures and structures formed thereby

Methods of forming ultra thin package structures including low temperature solder and structures formed therby

Double-mated edge finger connector

SWAMINATHAN RAJASEKARAN

Magnetically sintered conductive via

Magnetic microelectronic device attachment

Magnetic intermetallic compound interconnect

Forming sacrificial composite materials for package-on-package architectures and structures formed thereby

Magnetic particle-based composite materials for semiconductor packages

APPLE INC

Package integration using fanout cavity substrate

Socket with integrated flex connector

XU DINGYING

Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die

Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die

GANESAN SANKA

Package-on-package interconnect stiffener

DEPPISCH CARL L

Clad solder thermal interface material

ALEKSOV ALEKSANDAR

Magnetic attachment structure

ADVANCED MICRO DEVICES INC

Glass core package substrates