Inventor

ZHANG ZHICHAO

US116 patents

⚠️ This page may combine multiple inventors who share the name “ZHANG ZHICHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHANG ZHICHAO

INTEL CORP

Shielded socket housing

Chip-to-chip interconnect with embedded electro-optical bridge structures

Helically insulated twinax cable systems and methods

Non-uniform substrate stackup

Connector assembly and method

Antenna modules and communication devices

Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

Low loss and low cross talk transmission lines using shaped vias

CPU package substrates with removable memory mechanical interfaces

Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chip

Slow wave structure for millimeter wave antennas

Antenna package using ball attach array to connect antenna and base substrates

Edge-firing antenna walls built into substrate

Reduced capacitance land pad

Chip-to-chip interconnect with embedded electro-optical bridge structures

Connector assembly and method

Flexible package-to-socket interposer

Antenna modules and communication devices

Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket

Antenna modules and communication devices

Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards

CPU socket contact for improving bandwidth throughput

Coupled vias for channel cross-talk reduction

Horizontal pitch translation using embedded bridge dies

Integrated circuit structures in package substrates

Integrated circuit structures in package substrates

Reduced capacitance land pad

Non-uniform substrate stackup

Antenna package using ball attach array to connect antenna and base substrates

Through-substrate optical vias

Microelectronic assemblies having conductive structures with different thicknesses on a core substrate

JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO LTD

LED lighting device and novel grille lamp

LED lighting device

LED lighting device with enhanced light transmission

LED lighting device

ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO LTD

LED filament and LED light bulb

LED filament and LED light bulb

LED filament and LED light bulb

BOE TECHNOLOGY GROUP CO LTD

Method for manufacturing array substrate, array substrate and display device

Touch display panel having a plurality of spacers connected to a thin film transistor and manufacturing method thereof

Manufacturing method of metal layer, functional substrate and manufacturing method thereof, and display device

FUTU NETWORK TECH SHENZHEN CO LTD

Display screen or portion thereof with animated graphical user interface for displaying fund information

Display screen or portion thereof with animated graphical user interface for fund purchase

ZHANG ZHICHAO

Crosstalk polarity reversal and cancellation through substrate material tuning

Mechanism for facilitating dynamic cancellation of signal crosstalk in differential input/output channels

UNIV ARIZONA

Compact broad-band admittance tunnel incorporating gaussian beam antennas

GANESAN SANKA

Flex cable and method for making the same

HEPPNER JOSHUA D

Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate

SONG HONGJIANG

Smart impedance matching for high-speed I/O

CHEN LI

Methods and devices for detecting single-event transients