Inventor

GANESAN SANKA

US60 patents

⚠️ This page may combine multiple inventors who share the name “GANESAN SANKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GANESAN SANKA

INTEL CORP

System interconnect for integrated circuits

Input/output package architectures, and methods of using same

High density package interconnects

Ultra-thin, hyper-density semiconductor packages

Microelectronic component having molded regions with through-mold vias

CPU package substrates with removable memory mechanical interfaces

Integrated circuit connectors

Substrate package with through holes for high speed I/O flex cable

Chip scale thin 3D die stacked package

Stacked silicon die architecture with mixed flipcip and wirebond interconnect

Planar integrated circuit package interconnects

Edge-firing antenna walls built into substrate

Planar integrated circuit package interconnects

High density package interconnects

High density package interconnects

Shaped and oriented solder joints

Microelectronic component having molded regions with through-mold vias

Integrated circuit assemblies with direct chip attach to circuit boards

Microelectronic component having molded regions with through-mold vias

Multi-die ultrafine pitch patch architecture and method of making

Interposer package-on-package (PoP) with solder array thermal contacts

Rlink—die to die channel interconnect configurations to improve signaling

Integrated circuit structures in package substrates

Integrated circuit structures in package substrates

Scalable high speed high bandwidth IO signaling package architecture and method of making

Coupled cooling fins in ultra-small systems

Scalable package architecture and associated techniques and configurations

Planar integrated circuit package interconnects

Ultra-thin, hyper-density semiconductor packages

Ultra-thin, hyper-density semiconductor packages

Low cost embedded integrated circuit dies

Microelectronic assemblies with direct attach to circuit boards

Coreless electronic substrates having embedded inductors

Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making

Microelectronic component having molded regions with through-mold vias

Integrated circuit structures in package substrates

Thermal management solutions for integrated circuit packages

Scalable package architecture and associated techniques and configurations

Electronic package with stud bump electrical connections

Electronic package with stud bump electrical connections

Inorganic redistribution layer on organic substrate in integrated circuit packages

Method of making substrate package with through holes for high speed I/O flex cable

GANESAN SANKA

Input/output package architectures

Package on package architecture and method for making

Package-on-package interconnect stiffener

High density package interconnects

Flex cable and method for making the same

Integrated circuit packages

Low profile zero/low insertion force package top side flex cable connector architecture

ALEKSOV ALEKSANDAR

Shaped and oriented solder joints