Inventor
CHEN SHIUH-HUI STEVEN
US20 patents
⚠️ This page may combine multiple inventors who share the name “CHEN SHIUH-HUI STEVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
Continental automotive systems inc
8 patentsUS9846095B2Dec 19, 2017
3D stacked piezoresistive pressure sensor
Continental automotive systems inc11 citations82
US9964458B2May 8, 2018
Pressure sensor device with anchors for die shrinkage and high sensitivity
Continental automotive systems inc2 citations72
US9764947B2Sep 19, 2017
Piezoresistive pressure sensor device
Continental automotive systems inc5 citations72
US9846096B2Dec 19, 2017
Symmetrical piezoresistive pressure sensor with stacking ICs
Continental automotive systems inc3 citations71
US10060820B2Aug 28, 2018
Stress-isolated absolute pressure sensor
Continental automotive systems inc5 citations68
US11029227B2Jun 8, 2021
CSOI MEMS pressure sensing element with stress equalizers
Continental automotive systems inc1 citations62
US10221062B2Mar 5, 2019
Cavity with silicon on insulator MEMS pressure sensing device with an extended shallow cross-shaped cavity
Continental automotive systems inc1 citations62
US9651441B2May 16, 2017
Pressure sensor device with high sensitivity and high accuracy
Continental automotive systems inc1 citations51
MOTOROLA INC
6 patentsUS6608370B1Aug 19, 2003
Semiconductor wafer having a thin die and tethers and methods of making the same
MOTOROLA INC146 citations95
US6881648B2Apr 19, 2005
Semiconductor wafer having a thin die and tethers and methods of making the same
MOTOROLA INC58 citations92
US6427539B1Aug 6, 2002
Strain gauge
MOTOROLA INC33 citations86
US5744725AApr 28, 1998
Capacitive pressure sensor and method of fabricating same
MOTOROLA INC15 citations72
US7009124B2Mar 7, 2006
Acceleration switch
MOTOROLA INC7 citations68
US6772509B2Aug 10, 2004
Method of separating and handling a thin semiconductor die on a wafer
MOTOROLA INC5 citations54
CHIOU JEN-HUANG ALBERT
3 patentsUS8881596B2Nov 11, 2014
Semiconductor sensing device to minimize thermal noise
CHIOU JEN-HUANG ALBERT12 citations83
US8191423B2Jun 5, 2012
Grooved structure for die-mount and media sealing
CHIOU JEN-HUANG ALBERT8 citations83
US8302483B2Nov 6, 2012
Robust design of high pressure sensor device
CHIOU JEN-HUANG ALBERT3 citations62