Inventor

WU CHIN-TA

TW8 patents

⚠️ This page may combine multiple inventors who share the name “WU CHIN-TA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

POWERTECH TECHNOLOGY INC

5 patents

US10388535B1Aug 20, 2019

Wafer processing method with full edge trimming

POWERTECH TECHNOLOGY INC7 citations73

US11367641B2Jun 21, 2022

Wafer storage device, carrier plate and wafer cassette

POWERTECH TECHNOLOGY INC6 citations67

US11410945B2Aug 9, 2022

Semiconductor package having partial outer metal layer and packaging method thereof

POWERTECH TECHNOLOGY INC0 citations56

US11587808B2Feb 21, 2023

Chip carrier device

POWERTECH TECHNOLOGY INC0 citations45

US11658046B2May 23, 2023

Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof

POWERTECH TECHNOLOGY INC0 citations44

TAIWAN SEMICONDUCTOR MFG

1 patent

US6869837B1Mar 22, 2005

Methods of fabricating a word-line spacer for wide over-etching window on outside diameter (OD) and strong fence

TAIWAN SEMICONDUCTOR MFG11 citations72

WU CHIN-TA

1 patent

US7000805B1Feb 21, 2006

PU foam rubber fluid applicator

WU CHIN-TA15 citations71

MOSEL VITELIC INC

1 patent

US6037251AMar 14, 2000

Process for intermetal SOG/SOP dielectric planarization

MOSEL VITELIC INC11 citations69