Inventor

WALLACE CHARLES H

US98 patents

⚠️ This page may combine multiple inventors who share the name “WALLACE CHARLES H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WALLACE CHARLES H

INTEL CORP

Self-aligned via and plug patterning for back end of line (BEOL) interconnects

Sub-resolution assist features

Sub-resolution assist features for photolithography with trim ends

Subtractive self-aligned via and plug patterning for back end of line (BEOL) interconnects

Advanced lithography and self-assembled devices

Self-aligned isotropic etch of pre-formed vias and plugs for back end of line (BEOL) interconnects

Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects

Pre-patterned hard mask for ultrafast lithographic imaging

Pattern decomposition lithography techniques

Double patterning techniques and structures

Diagonal corner-to-corner sub-resolution assist features for photolithography

Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structures

Integrated circuit structures having dielectric anchor void

Advanced lithography and self-assembled devices

Advanced lithography and self-assembled devices

Method to repair edge placement errors in a semiconductor device

Advanced lithography and self-assembled devices

Pitch division patterning approaches with increased overlay margin for back end of line (BEOL) interconnect fabrication and structures resulting therefrom

Self-aligned via and plug patterning for back end of line (BEOL) interconnects

Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects

Pattern decomposition lithography techniques

Pattern decomposition lithography techniques

Conductive via and metal line end fabrication and structures resulting therefrom

Spacer self-aligned via structures using directed self assembly for gate contact or trench contact

Integrated circuit structures with deep via structure

Integrated circuit structures having dielectric anchor void

Integrated circuit structures with backside gate cut or trench contact cut

Gate aligned contact and method to fabricate same

Gate aligned contact and method to fabricate same

Gate aligned contact and method to fabricate same

Self-aligned via and plug patterning for back end of line (BEOL) interconnects

Gate aligned contact and method to fabricate same

Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication

Integrated circuit structures having conductive structures in fin isolation regions

Deep etch processing for transistors having varying pitch

Integrated circuit structures having backside gate tie-down

ITT

Arrangement to improve the optimization of the value of finished cuts in a livestock processing plant

Internal heat exchanger for meat

Hog processing method

Lift device arrangement

Computer directed primal cut indicating device

Method and apparatus for measuring carcasses

Method and apparatus for measuring carcasses

Methods for computer assisted optimization of meat cuts from carcasses

UNIV CALIFORNIA

Rapid synthesis of carbon nanotubes and carbon encapsulated metal nanoparticles by a displacement reaction

Instantaneous synthesis of refractory nitrides from solid precursors

Process for rapid solid-state formation of refractory nitrides

WALLACE CHARLES H

Pattern decomposition lithography techniques

Method for changing the internal temperature of meat by the use of gas

GOLONZKA OLEG

Gate aligned contact and method to fabricate same